Inventor
HEH-CHANG HUANG
Inventor
TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
G02BOptical elements, systems or apparatus9%
H04BTransmission9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
PatentTitleYear
12,347,817Semiconductor device package having warpage control202512,294,002Integrated circuit package and method of forming same202512,261,125Method for forming chip package structure202512,015,023Integrated circuit package and method of forming same202411,978,729Semiconductor device package having warpage control and method of forming the same202411,804,445Method for forming chip package structure202311,764,123Semiconductor package, integrated optical communication system202311,694,939Semiconductor package, integrated optical communication system2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (8)· patent assignee history
2023–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 8 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 8 | 2023–2025 |