Inventor
Kuei-Pin Lee
Inventor
New Taipei, TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H01LSemiconductor devices28%
H10DInorganic electric semiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
PatentTitleYear
10,276,431Device and method for reducing contact resistance of a metal20199,892,963'Device and method for reducing contact resistance of a metal'20189,159,666'Device and method for reducing contact resistance of a metal'20159,064,934'Barrier layer for copper interconnect'20158,872,342'Barrier layer for copper interconnect'20148,778,801'Method for forming seed layer structure'20148,722,531'Barrier layer for copper interconnect'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2015Patents assigned to TAIWAN SEMICONDUCTOR MFG (5)· patent assignee history
2014–2019Based in New Taipei, TW· patent location history
2018–2019Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 5 | 2014–2015 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 2 | 2018–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Taipei, TW | 7 | 2014–2019 |