Inventor
Mark B. Trobough
Inventor
Olympia, WA, US
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits23%
G01RMeasuring electric variables17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H01RElectrically-conductive connections12%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
B23PMetal-working not otherwise provided for6%
H01LSemiconductor devices6%
Y10TTechnical subjects covered by former us classification6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
G02BOptical elements, systems or apparatus2%
PatentTitleYear
10,198,333Test, validation, and debug architecture20199,418,906'Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates'20169,111,927'Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates'20158,834,184'Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates'20148,212,350'Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates'20127,641,481'Non-intrusive interposer for accessing integrated circuit package signals'20107,402,048'Technique for blind-mating daughtercard to mainboard'20087,344,318'Optical interconnect with passive optical alignment'20087,278,858'Socket with integral, retractable socket contact protector'20077,248,481'Circuit board and system with a multi-portion socket'20077,248,036'Method and apparatus to probe bus signals using repeaters'20076,971,887'Multi-portion socket and related apparatuses'20056,539,614'Apparatus for producing high efficiency heat sinks'20036,374,491'Method and apparatus for producing high efficiency heat sinks'20026,347,946'Pin grid array socket'20026,202,303'Method for producing high efficiency heat sinks'20015,603,619'Scalable test interface port'19975,594,356'Interconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit components'19975,418,469'Interconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit components'19954,993,958'High density planar interconnect'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991Based in Beaverton, OR, US· patent location history
1995–2019Patents assigned to INTEL CORP (19)· patent assignee history
1995–1997Based in Aloha, OR, US· patent location history
2001–2019Based in Olympia, WA, US· patent location history
2012–2019Patents assigned to TROBOUGH MARK B (4)· patent assignee history
2012–2015Patents assigned to BALDWIN CHRISTOPHER S (3)· patent assignee history
2019Patents assigned to BAUDREXL JOHN L (1)· patent assignee history
2019Patents assigned to CHEAH WEE HOO (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 19 | 1995–2019 |
| TROBOUGH MARK Bself | 4 | 2012–2019 |
| BALDWIN CHRISTOPHER S | 3 | 2012–2015 |
| BAUDREXL JOHN L | 1 | 2019 |
| CHEAH WEE HOO | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Olympia, Washington, US | 16 | 2001–2019 |
| Aloha, OR, US | 3 | 1995–1997 |
| Beaverton, OR, US | 1 | 1991 |