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Inventor

Brian L. Mueller

Inventor
Aurora, IL, US

Overview

40→
Patents
1995–2021
Patent span
Chemistry
Primary field (CPC C)

Patents· 40 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
C09KMaterials for miscellaneous applications, not provided for elsewhere18%
C09GPolishing compositions15%
B24BMachines, devices, or processes for grinding or polishing8%
C23FNon-mechanical removal of metallic material from surface4%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool3%
E21BEarth or rock drilling3%
C08JWorking-up2%
C25FProcesses for the electrolytic removal of materials from objects2%
G11BInformation storage based on relative movement between record carrier and transducer2%
PatentTitleYear
11,111,429Compositions and methods for delayed crosslinking in hydraulic fracturing fluids202110,767,104Compositions for enhanced oil recovery202010,400,157Surfactant assisted oil recovery using alcohol ether sulfonates and cationic surfactants20199,926,486'Surfactant assisted oil recovery using alcohol ether sulfonates and cationic surfactants'20189,404,033'Environmentally beneficial recycling of brines in the process of reducing friction resulting from turbulent flow'20169,000,084'Controlled geometry composite micro pellets for use in compression molding'20158,663,524'Controlled geometry composite micro pellets for use in compression molding'20148,268,135'Method and apparatus for electrochemical planarization of a workpiece'20127,365,013'System for the preferential removal of silicon oxide'20087,297,633'Compositions for chemical mechanical polishing silica and silicon nitride having improved endpoint detection'20077,291,280'Multi-step methods for chemical mechanical polishing silicon dioxide and silicon nitride'20077,238,618'System for the preferential removal of silicon oxide'20076,984,588'Compositions for oxide CMP'20066,974,525'Method and apparatus for electrochemical planarization of a workpiece'20056,849,547'Apparatus and process for polishing a workpiece'20056,736,952'Method and apparatus for electrochemical planarization of a workpiece'20046,726,534'Preequilibrium polishing method and system'20046,716,755'Composition and method for planarizing surfaces'20046,689,692'Composition for oxide CMP'20046,612,911'Alkali metal-containing polishing system and method'20036,572,755'Method and apparatus for electrochemically depositing a material onto a workpiece surface'20036,533,832'Chemical mechanical polishing slurry and method for using same'20036,527,817'Composition and method for planarizing surfaces'20036,435,947'CMP polishing pad including a solid catalyst'20026,383,065'Catalytic reactive pad for metal CMP'20026,362,104'Method for polishing a substrate using a CMP slurry'20026,350,393'Use of CsOH in a dielectric CMP slurry'20026,319,096'Composition and method for planarizing surfaces'20016,293,848'Composition and method for planarizing surfaces'20016,177,026'CMP slurry containing a solid catalyst'20016,096,806'Storage stable autodepositable dispersions of epoxy resins and processes therefor and therewith'20006,068,787'Composition and slurry useful for metal CMP'20006,015,506'Composition and method for polishing rigid disks'20005,993,686'Fluoride additive containing chemical mechanical polishing slurry and method for use of same'19995,980,775'Composition and slurry useful for metal CMP'19995,958,288'Composition and slurry useful for metal CMP'19995,858,813'Chemical mechanical polishing slurry for metal layers and films'19995,759,917'Composition for oxide CMP'19985,552,076'Anhydrous amorphous ceramics as the particulate phase in electrorheological fluids'19965,418,298'Neutral and mixed neutral/anionic polymetallooxanes'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2001Patents assigned to CABOT CORP (8)· patent assignee history
1998–2008Based in Aurora, IL, US· patent location history
2001–2008Patents assigned to CABOT MICROELECTRONICS CORP (16)· patent assignee history
2002–2012Based in Chandler, AZ, US· patent location history
2003–2005Patents assigned to SPEEDFAM IPEC CORP (4)· patent assignee history
2004–2007Based in Middletown, DE, US· patent location history
2014–2015Patents assigned to ALVAREZ EDUARDO (2)· patent assignee history
2016–2020Patents assigned to ECOLAB USA INC (4)· patent assignee history
2016–2019Based in Missouri City, TX, US· patent location history
2020–2021Based in Sugar Land, TX, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CABOT MICROELECTRONICS CORP162001–2008
CABOT CORP81998–2001
ECOLAB USA INC42016–2020
SPEEDFAM IPEC CORP42003–2005
ALVAREZ EDUARDO22014–2015
Locations
LocationPatentsSpan
Aurora, Illinois, US191998–2008
Chandler, AZ, US72002–2012
Missouri City, Texas, US32016–2019
Middletown, Delaware, US32004–2007
Sugar Land, Texas, US22020–2021