Inventor

Kazuaki Karasawa

Inventor

Kawasaki, JP

Overview

1994–2019

Patent span

Electricity

Primary field (CPC H)

Patents· 16 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%

H05KPrinted circuits24%

B23KSoldering or unsoldering10%

Y02PClimate change mitigation technologies in the production or processing of goods10%

G01NInvestigating or analysing materials by determining their chemical or physical properties7%

H10DInorganic electric semiconductor devices7%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%

A61BDiagnosis2%

G06FElectric digital data processing2%

Y02ATechnologies for adaptation to climate change2%

PatentTitleYear

10,495,595Gas sensor device, gas measurement method, and gas measurement device2019 10,481,146Gas sensor and information processing system2019 10,371,658Gas sensor and sensor apparatus2019 9,820,412'Modular data center'2017 7,339,277'Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate'2008 6,873,038'Capacitor and semiconductor device and method for fabricating the semiconductor device'2005 6,764,938'Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof'2004 6,624,501'Capacitor and semiconductor device'2003 6,608,381'Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof'2003 6,136,047'Solder bump transfer plate'2000 6,121,062'Process of fabricating semiconductor unit employing bumps to bond two components'2000 6,008,071'Method of forming solder bumps onto an integrated circuit device'1999 5,977,637'Integrated electronic device having flip-chip connection with circuit board'1999 5,877,079'Method for manufacturing a semiconductor device and a method for mounting a semiconductor device for eliminating a void'1999 5,611,481'Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof'1997 5,284,796'Process for flip chip connecting a semiconductor chip'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2019Patents assigned to FUJITSU LTD (16)· patent assignee history

1994–2008Based in Kawasaki, JP· patent location history

2017–2019Based in Hadano, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
FUJITSU LTD	16	1994–2019

Locations

Location	Patents	Span
Kawasaki, JP	12	1994–2008
Hadano, JP	4	2017–2019