Inventor
Jens Frey
Inventor
Filderstadt, DE
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Cprimary
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems29%
B81BMicrostructural devices or systems, e.g. micromechanical devices24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
H01LSemiconductor devices11%
G01CMeasuring distances, levels or bearings7%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock5%
Y10TTechnical subjects covered by former us classification4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure1%
G01RMeasuring electric variables1%
PatentTitleYear
10,752,498MEMS component having two different internal pressures202010,000,375Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface20189,926,188'Sensor unit including a decoupling structure and manufacturing method therefor'20189,919,919'Laser reseal including an additional layer and alloy formation'20189,688,527'Micromechanical component and method for producing a micromechanical component'20179,606,141'Micromechanical sensor device'20179,567,212'Micromechanical component'20179,475,693'ASIC element, in particular as a component of a vertically integrated hybrid component'20169,416,000'Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements'20169,406,747'Component in the form of a wafer level package and method for manufacturing same'20169,365,417'Method for manufacturing a micromechanical component'20169,266,720'Hybrid integrated component'20169,153,523'ASIC element including a via'20159,123,716'Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates'20159,114,978'Method for manufacturing a component having an electrical through-connection'20159,040,336'Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap'20159,034,757'Method for manufacturing a component having an electrical through-connection'20158,975,118'Component having a via and method for manufacturing it'20158,941,193'Method for manufacturing a hybrid integrated component'20158,835,222'Method for producing a two-chip assembly and corresponding two-chip assembly'20148,759,927'Hybrid intergrated component'20148,748,998'Sensor module'20148,647,961'Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches'20148,490,483'Micromechanical yaw-rate sensor'20137,919,346'Micromechanical component and manufacturing method'20117,316,161'Rotation rate sensor'20087,313,958'Rotational rate sensor'20087,270,868'Micromechanical component'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2020Patents assigned to BOSCH GMBH ROBERT (28)· patent assignee history
2007–2020Based in Filderstadt, DE· patent location history
2013–2016Patents assigned to FREY JENS (13)· patent assignee history
2013–2016Patents assigned to CLASSEN JOHANNES (4)· patent assignee history
2014–2016Patents assigned to WEBER HERIBERT (7)· patent assignee history
2015–2016Patents assigned to FISCHER FRANK (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| BOSCH GMBH ROBERT | 28 | 2007–2020 |
| FREY JENSself | 13 | 2013–2016 |
| WEBER HERIBERT | 7 | 2014–2016 |
| CLASSEN JOHANNES | 4 | 2013–2016 |
| FISCHER FRANK | 3 | 2015–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Filderstadt, DE | 28 | 2007–2020 |