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Inventor

Cheng-Liang Cho

Inventor
Tainan, TW

Overview

2→
Patents
2019
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form11%
C22CAlloys11%
H01BCables11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
10,213,986Electric connection and method of manufacturing the same201910,170,429Method for forming package structure including intermetallic compound2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
2019Patents assigned to UNIV NAT CHENG KUNG (1)· patent assignee history
2019Based in Tainan, TW· patent location history
2019Based in Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD12019
UNIV NAT CHENG KUNG12019
Locations
LocationPatentsSpan
Tainan, TW12019
Taipei, TW12019