Inventor
Takenobu Kishida
Inventor
Osaka, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1031%
H10DInorganic electric semiconductor devices15%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
PatentTitleYear
7,233,073'Semiconductor device and method for fabricating the same'20077,037,371'Method for fabricating semiconductor device'20067,001,841'Production method of semiconductor device'20066,963,139'Semiconductor device including a layer having a β-crystal structure'20056,951,809'Method for manufacturing semiconductor device'20056,770,977'Semiconductor device and method for fabricating the same'20046,746,962'Method for fabricating a semi-conductor device having a tungsten film-filled via hole'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2007Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (7)· patent assignee history
2004Based in Settsu, JP· patent location history
2005–2007Based in Osaka, JP· patent location history
2006Based in Nagaokakyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 7 | 2004–2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 4 | 2005–2007 |
| Settsu, JP | 2 | 2004 |
| Nagaokakyo, JP | 1 | 2006 |