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Inventor

Ee Hua Wong

Inventor
Singapore, SG

Overview

4→
Patents
2005–2009
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits30%
G01NInvestigating or analysing materials by determining their chemical or physical properties20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
Y02PClimate change mitigation technologies in the production or processing of goods20%
B23KSoldering or unsoldering10%
PatentTitleYear
7,500,378'Micro-impact testing apparatus'20097,464,606'Bend testing apparatus and method of carrying out the same'20087,178,711'Method and device to elongate a solder joint'20076,890,795'Wafer level super stretch solder'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2007Patents assigned to GEORGIA TECH RES INST (2)· patent assignee history
2005–2009Based in Singapore, SG· patent location history
2008–2009Patents assigned to AGENCY SCIENCE TECH & RES (2)· patent assignee history
2008Patents assigned to UNIV SINGAPORE (1)· patent assignee history
2009Patents assigned to ILLINOIS TOOL WORKS (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
AGENCY SCIENCE TECH & RES22008–2009
GEORGIA TECH RES INST22005–2007
ILLINOIS TOOL WORKS12009
UNIV SINGAPORE12008
Locations
LocationPatentsSpan
Singapore, SG42005–2009