Inventor

Hisashi Shimizu

Inventor

Annaka, JP

Overview

1982–2021

Patent span

Chemistry

Primary field (CPC C)

Patents· 50 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Gprimary

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds14%

C08LCompositions of macromolecular compounds14%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%

H05KPrinted circuits6%

LOC236%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%

Y10TTechnical subjects covered by former us classification5%

H10HInorganic light-emitting semiconductor devices having potential barriers3%

B05DProcesses for applying fluent materials to surfaces, in general2%

C07CAcyclic or carbocyclic compounds2%

PatentTitleYear

11,016,440Cartridge reproduction method and cartridge2021 9,726,916'Member bonding apparatus'2017 8,013,056'White heat-curable silicone resin composition, optoelectronic part case, and molding method'2011 7,563,854'Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof'2009 7,550,204'Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element'2009 D0553725'Outdoor-unit of air-conditioner'2007 D0550822'Air conditioner'2007 D0539884'Out door unit for humidifier'2007 D0539885'Air conditioner'2007 D0532889'Out door unit for air conditioner'2006 D0532503'Out door unit for air conditioner'2006 D0498296'Air purifier'2004 D0489801'Air purifier'2004 6,730,933'Hybrid integrated circuit device'2004 6,591,104'Method for handover'2003 6,548,832'Hybrid integrated circuit device'2003 6,489,637'Hybrid integrated circuit device'2002 6,470,188'Method for handover'2002 6,330,162'IC card module, manufacturing method therefor, hybrid integrated circuit module, and manufacturing method thereof'2001 6,259,157'Hybrid integrated circuit device, and method of manufacturing thereof'2001 6,235,865'Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition'2001 6,210,811'Epoxy resin composition, laminate film using the same, and semiconductor device'2001 6,084,037'Epoxy resin composition and semiconductor device'2000 5,643,975'Epoxy resin compositions and cured products'1997 5,362,887'Fluorine - modified acid anhydrides'1994 5,340,851'Thermosetting resin compositions'1994 5,321,299'Hybrid integrated circuit device'1994 5,306,748'Fluorine-modified thermosetting resin and thermosetting resin composition'1994 5,300,588'Thermosetting resin compositions'1994 5,298,548'Epoxy resin composition and semiconductor devices encapsulated therewith'1994 5,290,882'Thermosetting resin compositions'1994 5,285,107'Hybrid integrated circuit device'1994 5,243,058'Allyl or propenyl group-containing naphthalene derivatives'1993 5,242,044'Apparatus for rotating and conveying an article to be painted on coating line'1993 5,220,991'Conveying apparatus for coating line'1993 5,182,351'Thermosetting resin compositions'1993 5,179,176'Propenyl group-containing epoxy resin'1993 5,173,544'Epoxy resin compositions'1992 5,171,869'Allyl or propenyl group-containing naphthalene derivatives'1992 5,159,433'Hybrid integrated circuit device having a particular casing structure'1992 5,053,445'Epoxy resin composition'1991 5,041,014'Electronic device having a pair of electrically connected insulating film coated covers'1991 4,985,751'Resin-encapsulated semiconductor devices'1991 4,877,822'Epoxy resin composition'1989 4,701,482'Epoxy resin composition for encapsulation of semiconductor devices'1987 4,678,688'Method for forming a surface film of cured organosilicon polymer on a substrate surface'1987 4,389,432'Method of improving adhesion and adhesion improvers used therefor'1983 4,331,820'Cis-6-undecene-1-chloride and a method for the preparation thereof'1982 4,332,012'Control system for automotive vehicle component assembly lines'1982 4,324,931'1-Halo-4-decene compounds'1982

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1982–2011Patents assigned to SHINETSU CHEMICAL CO (26)· patent assignee history

1983–2011Based in Annaka, JP· patent location history

1987–2004Based in Gunma, JP· patent location history

1992–2004Patents assigned to SANYO ELECTRIC CO (8)· patent assignee history

1992–1994Based in Ohta, JP· patent location history

1993Patents assigned to TSUBAKIMOTO CHAIN CO (2)· patent assignee history

2002–2003Patents assigned to NIPPON TELEGRAPH & TELEPHONE (2)· patent assignee history

2002–2003Based in Kokubunji, JP· patent location history

2004–2007Patents assigned to DAIKIN IND LTD (8)· patent assignee history

2004–2007Based in Kusatsu, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SHINETSU CHEMICAL CO	26	1982–2011
DAIKIN IND LTD	8	2004–2007
SANYO ELECTRIC CO	8	1992–2004
NIPPON TELEGRAPH & TELEPHONE	2	2002–2003
TSUBAKIMOTO CHAIN CO	2	1993

Locations

Location	Patents	Span
Annaka, JP	20	1983–2011
Kusatsu, JP	8	2004–2007
Gunma, JP	6	1987–2004
Ohta, JP	3	1992–1994
Kokubunji, JP	2	2002–2003