Inventor
Kum Weng Loo
Inventor
Singapore, SG
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1054%
H04NPictorial communication, e.g. television15%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems8%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure8%
G02BOptical elements, systems or apparatus8%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them8%
PatentTitleYear
8,338,943'Semiconductor package with thermal heat spreader'20128,013,438'Semiconductor package with a stiffening member supporting a thermal heat spreader'20117,919,361'Semiconductor package with position member'20117,880,132'Cap including a housing and optically transparent member to protect a camera module lens'20117,816,182'Simplified multichip packaging and package design'20107,745,945'Semiconductor package with position member'20107,061,697'Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device'20067,056,765'Semiconductor device package and method of manufacture'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2012Patents assigned to ST MICROELECTRONICS ASIA (6)· patent assignee history
2006–2012Based in Singapore, SG· patent location history
2011Patents assigned to ST MICROELECTRONICS PTE LTD (1)· patent assignee history
2011Patents assigned to ST MICROELECTRONICS RES & DEV (1)· patent assignee history
2011Patents assigned to ST MICROELECTRONICS SA (1)· patent assignee history
2012Patents assigned to LOO KUM WENG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ST MICROELECTRONICS ASIA | 6 | 2006–2012 |
| LOO KUM WENGself | 1 | 2012 |
| ST MICROELECTRONICS PTE LTD | 1 | 2011 |
| ST MICROELECTRONICS RES & DEV | 1 | 2011 |
| ST MICROELECTRONICS SA | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 8 | 2006–2012 |