Inventor
Lawrence D. David
Inventor
Wappingers Falls, NY, US
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
H05KPrinted circuits8%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds7%
C23FNon-mechanical removal of metallic material from surface7%
B82YSpecific uses or applications of nanostructures6%
C01GCompounds containing metals not covered by subclasses c01d or c01f6%
C04BLime, magnesia6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
C09KMaterials for miscellaneous applications, not provided for elsewhere5%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
6,691,618'Chemical imaging of a lithographic printing plate'20046,417,280'Fluoropolymeric composition'20026,358,439'Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias'20026,355,565'Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers'20026,294,105'Chemical mechanical polishing slurry and method for polishing metal/oxide layers'20016,284,151'Chemical mechanical polishing slurry for tungsten'20016,239,223'Fluoropolymeric composition'20016,221,269'Method of etching molybdenum metal from substrates'20016,130,170'Process improvements for titanium-tungsten etching in the presence of electroplated C4\'s'20006,124,041'Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias'20006,015,505'Process improvements for titanium-tungsten etching in the presence of electroplated C4\'s'20005,925,443'Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias'19995,525,761'Copper-based paste containing refractory metal additions for densification control'19965,518,131'Etching molydbenum with ferric sulfate and ferric ammonium sulfate'19965,512,711'Copper-based paste containing refractory metal additions for densification control'19965,277,725'Process for fabricating a low dielectric composite substrate'19945,213,704'Process for making a compliant thermally conductive compound'19935,135,595'Process for fabricating a low dielectric composite substrate'19925,094,769'Compliant thermally conductive compound'19924,995,942'Effective near neutral pH etching solution for molybdenum or tungsten'19914,954,142'Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor'19904,898,842'Organometallic-derived cordierite and other compounds comprising oxides of silicon'19904,798,701'Method of synthesizing amorphous group IIIA-group VA compounds'19894,747,907'Metal etching process with etch rate enhancement'19884,701,314'Method of producing microsized amorphous particles of metal phosphate'19874,588,576'Production of microcrystalline zirconia'19864,588,575'Production of microcrystalline metal oxides'19864,576,688'Production of poly(p-phenylene) from 4,4\'-dihalobiphenyl and lithium using ultrasonic waves'19864,567,101'Ferrimagnetic spinel fibers'19864,520,114'Production of metastable tetragonal zirconia'19854,486,401'Production of fine ferrimagnetic spinels'19844,485,085'Process for producing ferrimagnetic spinel fibers'19844,473,542'Production of microcrystalline ferrimagnetic spinels'19844,324,901'Soluble polysilastyrene and method for preparation'1982Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1982Patents assigned to WISCONSIN ALUMNI RES FOUND (1)· patent assignee history
1984–1986Patents assigned to CELANESE CORP (8)· patent assignee history
1984–1986Based in Florham Park, NJ, US· patent location history
1985–2002Based in Wappingers Falls, NY, US· patent location history
1987–2002Patents assigned to IBM (22)· patent assignee history
2000Based in Enfield, NH, US· patent location history
2001–2002Patents assigned to CHEMFAB CORP (2)· patent assignee history
2001–2002Based in Dover, NH, US· patent location history
2001–2004Based in Amherst, NH, US· patent location history
2004Patents assigned to PISCES PRINT IMAGING SCIENCES (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 22 | 1987–2002 |
| CELANESE CORP | 8 | 1984–1986 |
| CHEMFAB CORP | 2 | 2001–2002 |
| PISCES PRINT IMAGING SCIENCES | 1 | 2004 |
| WISCONSIN ALUMNI RES FOUND | 1 | 1982 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wappingers Falls, New York, US | 18 | 1985–2002 |
| Dover, NH, US | 5 | 2001–2002 |
| Florham Park, New Jersey, US | 5 | 1984–1986 |
| Amherst, NH, US | 2 | 2001–2004 |
| Enfield, NH, US | 2 | 2000 |