Inventor
Daniel Fischer
Inventor
Dresden, DE
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
G01NInvestigating or analysing materials by determining their chemical or physical properties12%
H01JElectric discharge tubes or discharge lamps6%
H01LSemiconductor devices6%
LOC016%
B81BMicrostructural devices or systems, e.g. micromechanical devices3%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%
E21BEarth or rock drilling3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
PatentTitleYear
10,185,312Insitu tool health and recipe quality monitoring on a CDSEM201910,115,621Method for in-die overlay control using FEOL dummy fill layer20189,171,765'Inline residual layer detection and characterization post via post etch using CD-SEM'20159,091,667'Detection of particle contamination on wafers'20159,006,681'Method of depositing protective structures'20158,575,041'Repair of damaged surface areas of sensitive low-K dielectrics of microstructure devices after plasma processing by in situ treatment'20138,440,579'Re-establishing surface characteristics of sensitive low-k dielectrics in microstructure device by using an in situ surface modification'20138,423,320'Method and system for quantitative inline material characterization in semiconductor production processes based on structural measurements and related models'20138,399,358'Establishing a hydrophobic surface of sensitive low-k dielectrics of microstructure devices by in situ plasma treatment'20138,338,293'Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices'20128,143,594'Method of depositing protective structures'20128,110,498'Method for passivating exposed copper surfaces in a metallization layer of a semiconductor device'20128,062,982'High yield plasma etch process for interlayer dielectrics'20117,986,040'Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices'20117,498,266'Method for structuring of silicon substrates for microsystem technological device elements and associated silicon substrate'2009D0469238'Segmented cooked dough food product'2003D0468889'Segmented cooked dough food product'20035,131,473'Controlled rate well cementing tool'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992Based in Vanderbilt, TX, US· patent location history
2003Based in Eagan, MN, US· patent location history
2009–2019Based in Dresden, DE· patent location history
2011–2013Patents assigned to FISCHER DANIEL (8)· patent assignee history
2011–2013Patents assigned to SCHALLER MATTHIAS (7)· patent assignee history
2011–2013Patents assigned to ADVANCED MICRO DEVICES INC (4)· patent assignee history
2013–2019Patents assigned to GLOBALFOUNDRIES INC (7)· patent assignee history
2013Patents assigned to OSZINDA THOMAS (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FISCHER DANIELself | 8 | 2011–2013 |
| GLOBALFOUNDRIES INC | 7 | 2013–2019 |
| SCHALLER MATTHIAS | 7 | 2011–2013 |
| ADVANCED MICRO DEVICES INC | 4 | 2011–2013 |
| OSZINDA THOMAS | 3 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dresden, DE | 15 | 2009–2019 |
| Eagan, Minnesota, US | 2 | 2003 |
| Vanderbilt, Texas, US | 1 | 1992 |