Inventor
CHING MENG FANG
Inventor
SG
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,469,791Semiconductor device and method of stacking hybrid substrates with embedded electric components202512,148,677Semiconductor device and method of forming ultra high density embedded semiconductor die package202411,227,809Semiconductor device and method of forming ultra high density embedded semiconductor die package2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to JCET SEMICONDUCTOR SHAOXING CO LTD (2)· patent assignee history
2022–2025Based in SG· patent location history
2025Patents assigned to STATS CHIPPAC PTE LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| JCET SEMICONDUCTOR SHAOXING CO LTD | 2 | 2022–2024 |
| STATS CHIPPAC PTE LTD | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| SG | 3 | 2022–2025 |