Inventor

WEN-HSONG WU

Inventor

Overview

2022–2025

Patent span

Mechanical engineering

Primary field (CPC F)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

F23Jprimary

F23JRemoval or treatment of combustion products or combustion residues25%

F27DDetails or accessories of furnaces, kilns, ovens or retorts, in so far as they are of kinds occurring in more than one kind of furnace25%

H01LSemiconductor devices25%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history

2022–2025Based in TW· patent location history

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	2	2022–2025

Locations

Location	Patents	Span
TW	2	2022–2025