Inventor

Shigeki Maekawa

Inventor

Tokyo, JP

Overview

20→

Patents

1991–2010

Patent span

Physics

Primary field (CPC G)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Rprimary

G01RMeasuring electric variables36%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%

B22DCasting of metals6%

B01DSeparation3%

B01JChemical or physical processes, e.g. catalysis or colloid chemistry3%

B08BCleaning in general3%

B22FWorking metallic powder3%

B23KSoldering or unsoldering3%

C22CAlloys3%

C22FChanging the physical structure of non-ferrous metals and non-ferrous alloys3%

PatentTitleYear

7,785,406'Apparatus for volatile organic compound treatment and method of volatile organic compound treatment'2010 7,534,979'Pressure-contact type rectifier with contact friction reducer'2009 7,276,923'Semiconductor device test probe'2007 7,274,195'Semiconductor device test probe'2007 7,112,976'Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested'2006 6,989,681'Socket for testing a semiconductor device and a connecting sheet used for the same'2006 6,888,344'Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter'2005 6,885,204'Probe card, and testing apparatus having the same'2005 6,882,069'Vehicle AC generator with rectifier diode package disposed between cooling plates'2005 6,794,890'Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested'2004 6,741,086'Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus'2004 6,667,626'Probe card, and testing apparatus having the same'2003 6,646,455'Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter'2003 6,633,176'Semiconductor device test probe having improved tip portion and manufacturing method thereof'2003 6,628,127'Probe card for testing semiconductor integrated circuit and method of manufacturing the same'2003 6,344,753'Test socket having improved contact terminals, and method of forming contact terminals of the test socket'2002 5,972,069'Metallic material made from tungsten or molybdenum, method of producing the metallic material, and secondary product material using the metallic material'1999 5,672,285'Laser casting apparatus and method'1997 5,433,262'Method for manufacturing casting and apparatus for manufacturing a casting'1995 5,067,550'Manufacturing method for defect-free casting product'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2010Patents assigned to MITSUBISHI ELECTRIC CORP (17)· patent assignee history

1991–1995Based in Amagasaki, JP· patent location history

1997Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (1)· patent assignee history

1997Based in Moriguchi, JP· patent location history

1999–2010Based in Tokyo, JP· patent location history

2003Patents assigned to MITSUBISHI DENKI KABSUHIKI KAI (1)· patent assignee history

2006Patents assigned to MISUBISHI DENKI KABUSHIKI KAIS (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MITSUBISHI ELECTRIC CORP	17	1991–2010
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD	1	1997
MISUBISHI DENKI KABUSHIKI KAIS	1	2006
MITSUBISHI DENKI KABSUHIKI KAI	1	2003

Locations

Location	Patents	Span
Tokyo, JP	17	1999–2010
Amagasaki, JP	2	1991–1995
Moriguchi, JP	1	1997