Inventor
Kenji Kameda
Inventor
Toyama, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material20%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
G07FCoin-freed or like apparatus10%
G09FDisplaying10%
H01BCables10%
H01RElectrically-conductive connections10%
PatentTitleYear
11,001,923Method of manufacturing semiconductor device and recording medium202110,998,647Harness with a wire terminal202110,968,517Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium20215,022,172'Display apparatus for an automatic vending machine'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991Patents assigned to SANYO ELECTRIC CO (1)· patent assignee history
1991Based in Gunma, JP· patent location history
2021Patents assigned to KOKUSAI ELECTRIC CORP (2)· patent assignee history
2021Patents assigned to HITACHI INT ELECTRIC INC (1)· patent assignee history
2021Patents assigned to JAPAN AVIATION ELECTRONICS IND LTD (1)· patent assignee history
2021Based in Toyama, JP· patent location history
2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KOKUSAI ELECTRIC CORP | 2 | 2021 |
| HITACHI INT ELECTRIC INC | 1 | 2021 |
| JAPAN AVIATION ELECTRONICS IND LTD | 1 | 2021 |
| SANYO ELECTRIC CO | 1 | 1991 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toyama, JP | 2 | 2021 |
| Tokyo, JP | 1 | 2021 |
| Gunma, JP | 1 | 1991 |