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Inventor

WEN HAO HSU

Inventor
CN

Overview

3→
Patents
2023–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
G01MTesting static or dynamic balance of machines or structures17%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices17%
PatentTitleYear
11,988,575Reticle defect inspection method and system202411,798,904Semiconductor structure, redistribution layer (RDL) structure, and manufacturing method thereof202311,605,605Redistribution layer (RDL) structure, semiconductor device and manufacturing method thereof2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2024Patents assigned to CHANGXIN MEMORY TECH INC (3)· patent assignee history
2023–2024Based in CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHANGXIN MEMORY TECH INC32023–2024
Locations
LocationPatentsSpan
CN32023–2024