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Inventor

Tung-Sheng Lee

Inventor
Hsinchu, TW

Overview

3→
Patents
2015–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices25%
B64CAeroplanes13%
B64DEquipment for fitting in or to aircraft13%
E03FSewers13%
H10NElectric solid-state devices not otherwise provided for13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
PatentTitleYear
10,883,261Waste transfer unit20219,761,791'Conductive pad structure and method of fabricating the same'20179,070,652'Test structure for semiconductor process and method for monitoring semiconductor process'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015–2017Patents assigned to UNITED MICROELECTRONICS CORP (2)· patent assignee history
2015Patents assigned to LEE TUNG-SHENG (1)· patent assignee history
2015Patents assigned to SHIU JIAN-BIN (1)· patent assignee history
2015–2017Based in Hsinchu, TW· patent location history
2021Patents assigned to MAG AEROSPACE IND LLC (1)· patent assignee history
2021Based in Coto de Caza, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UNITED MICROELECTRONICS CORP22015–2017
LEE TUNG-SHENGself12015
MAG AEROSPACE IND LLC12021
SHIU JIAN-BIN12015
Locations
LocationPatentsSpan
Hsinchu, TW22015–2017
Coto de Caza, California, US12021