Inventor

Tohru Yoshida

Inventor

Tokyo, JP

Overview

39→

Patents

1989–2020

Patent span

Performing operations

Primary field (CPC B)

Patents· 39 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B21Dprimary

B21DWorking or processing of sheet metal or metal tubes, rods or profiles without essentially removing material20%

G06FElectric digital data processing8%

G01NInvestigating or analysing materials by determining their chemical or physical properties6%

H10BElectronic memory devices6%

B21JForging5%

C21DModifying the physical structure of ferrous metals5%

G11BInformation storage based on relative movement between record carrier and transducer5%

H10DInorganic electric semiconductor devices5%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%

PatentTitleYear

10,857,583Press-working apparatus, press-working method, and press-molded product2020 10,695,814Method for manufacturing press-formed product, device for manufacturing press-formed product, mandrel, and press-formed product2020 10,639,699Shearing method2020 10,639,698Shearing method2020 10,562,091Burring method and burring apparatus2020 10,508,909Line displacement evaluation method, line displacement evaluation device, program, and recording medium2019 10,467,361Stretch flange crack prediction method, stretch flange crack prediction apparatus, computer program, and recording medium2019 10,444,732Blank shape determining method, blank, press formed product, press forming method, computer program, and recording medium2019 10,377,200Coupling structure, coupling member having coupling structure, and method for manufacturing coupling member having coupling structure2019 10,352,836Evaluation method of plastic material and evaluation method of deformation processing of plastic material2019 10,220,662Coupling structure, coupling member having coupling structure, and method for manufacturing coupling member having coupling structure2019 10,220,427Press-molding apparatus, press-molding method, and press-molded product2019 10,010,917Plastic working method of metals and plastic working apparatus2018 9,878,362'Press-forming tool and method for manufacturing press-formed product'2018 9,767,234'Method of identification of cause and/or location of cause of occurrence of springback'2017 9,481,021'Load-applying device, press-forming die, and press-forming method'2016 8,990,028'Fracture prediction method, device, a program arrangement and computer-accessible medium therefor'2015 8,763,438'Working apparatus and working method of sheet metal'2014 8,589,121'Fracture prediction method, processing device, program product and recording medium'2013 8,040,398'Imaging apparatus and method for displaying zoom information'2011 7,379,264'System and method for accessing a cartridge cell that compensates for misalignment between the system and the cell'2008 7,123,561'Device that records on an optical disc and method thereof'2006 6,962,631'Steel plate excellent in shape freezing property and method for production thereof'2005 6,829,204'Method of controlling a rotational rate of an optical disc and optical disc recording device using the same'2004 6,633,524'Method for controlling rotation of an optical disk during a zone change in a data read out operation'2003 6,632,296'Steel pipe having high formability and method for producing the same'2003 6,375,765'Ferrite-based thin steel sheet excellent in shape freezing feature and manufacturing method thereof'2002 6,011,292'Semiconductor device having an alignment mark'2000 5,460,984'Method of manufacturing a semi conductor device having a second well formed within a first well'1995 5,387,265'Semiconductor wafer reaction furnace with wafer transfer means'1995 5,334,875'Stacked semiconductor memory device and semiconductor memory module containing the same'1994 5,278,090'Method for manufacturing a dynamic RAM having 3-dimensional memory cell structure'1994 5,198,888'Semiconductor stacked device'1993 5,191,397'SOI semiconductor device with a wiring electrode contacts a buried conductor and an impurity region'1993 5,166,762'Dynamic RAM having 3-dimensional memory cell structure'1992 5,049,956'Memory cell structure of semiconductor memory device'1991 5,028,986'Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices'1991 4,974,658'Sheet shutter'1990 4,833,598'I/O interrupt handling mechanism in a multiprocessor system'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–1994Patents assigned to HITACHI LTD (4)· patent assignee history

1991–2000Patents assigned to TOSHIBA KK (6)· patent assignee history

1991–2000Based in Warabi, JP· patent location history

1995–2020Based in Tokyo, JP· patent location history

2002–2020Patents assigned to NIPPON STEEL CORP (12)· patent assignee history

2002–2005Based in Futtsu, JP· patent location history

2003–2006Based in Suwa, JP· patent location history

2013–2020Patents assigned to NIPPON STEEL & SUMITOMO METAL CORP (19)· patent assignee history

2013–2018Patents assigned to YOSHIDA TOHRU (6)· patent assignee history

2015–2020Based in Chiba, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
NIPPON STEEL & SUMITOMO METAL CORP	19	2013–2020
NIPPON STEEL CORP	12	2002–2020
TOSHIBA KK	6	1991–2000
YOSHIDA TOHRUself	6	2013–2018
HITACHI LTD	4	1989–1994

Locations

Location	Patents	Span
Tokyo, JP	15	1995–2020
Chiba, JP	7	2015–2020
Warabi, JP	6	1991–2000
Suwa, JP	3	2003–2006
Futtsu, JP	3	2002–2005