Inventor

Jim Flynn

Inventor
Corvallis, OR, US

Overview

2→
Patents
2008–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B28Bprimary
B28BShaping clay or other ceramic compositions17%
B29CShaping or joining of plastics17%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form17%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering17%
C04BLime, magnesia17%
H04LTransmission of digital information, e.g. telegraphic communication17%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008Patents assigned to LEVEL 3 COMMUNICATIONS LLC (1)· patent assignee history
2008Based in Stoughton, MA, US· patent location history
2021Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (1)· patent assignee history
2021Based in Corvallis, OR, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HEWLETT PACKARD DEVELOPMENT CO12021
LEVEL 3 COMMUNICATIONS LLC12008
Locations
LocationPatentsSpan
Corvallis, OR, US12021
Stoughton, Massachusetts, US12008