Inventor

Kenji Sakai

Inventor

Mitaka, JP

Overview

1985–2019

Patent span

Electricity

Primary field (CPC H)

Patents· 79 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary

Y10TTechnical subjects covered by former us classification10%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%

H05KPrinted circuits6%

F16CShafts6%

B24BMachines, devices, or processes for grinding or polishing5%

C09GPolishing compositions5%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%

C09KMaterials for miscellaneous applications, not provided for elsewhere4%

C22CAlloys4%

B01JChemical or physical processes, e.g. catalysis or colloid chemistry3%

PatentTitleYear

10,340,907Drive device for semiconductor element2019 9,981,864Oily water separator, oil-water separating method and filtration membrane unit2018 9,980,395Method of manufacturing laser diode unit utilizing submount bar2018 9,807,885'Wiring board with built-in electronic component and method for manufacturing the same'2017 9,625,927'Drive circuit'2017 9,444,249'Semiconductor driving device and semiconductor device'2016 9,363,891'Printed wiring board and method for manufacturing the same'2016 9,226,409'Method for manufacturing a wiring board'2015 9,167,653'Power supply device and luminaire'2015 9,117,730'Printed wiring board and method for manufacturing printed wiring board'2015 9,072,968'Game device, game control method, and game control program for controlling game on the basis of a position input received via touch panel'2015 9,021,692'Method for manufacturing a printed wiring board'2015 8,976,558'Power supply device with smoothing capacitor and falling voltage chopper circuit'2015 8,866,041'Apparatus and method of manufacturing laser diode unit utilizing submount bar'2014 8,803,561'Semiconductor circuit and semiconductor device'2014 8,779,830'Inverse level shift circuit'2014 8,724,357'Power semiconductor device including a bootstrap compensation circuit'2014 8,686,300'Printed wiring board and method for manufacturing the same'2014 8,624,127'Wiring board and method for manufacturing the same'2014 8,541,695'Wiring board and method for manufacturing the same'2013 8,465,710'Reactor'2013 8,418,360'Method for manufacturing a printed wiring board'2013 8,307,991'Hollow fiber membrane module'2012 8,188,380'Printed wiring board and method for manufacturing printed wiring board'2012 8,174,609'Camera module and electronic device including the same'2012 7,815,874'Reactor'2010 7,763,215'Reactor having detachably fixed tubesheet plate member'2010 7,550,388'Polishing composition and polishing method'2009 7,517,373'Reformer'2009 7,495,482'Semiconductor device'2009 7,485,162'Polishing composition'2009 7,227,577'Solid-state imaging module with frictionally attached shield cap'2007 7,189,684'Polishing composition and method for forming wiring structure using the same'2007 7,052,655'Urea synthesis process and apparatus'2006 6,905,779'Sliding material made of copper alloy, method of producing same, sliding bearing material, and method of producing same'2005 6,856,166'Status scheme signal processing circuit'2005 6,849,099'Polishing composition'2005 6,838,016'Polishing composition and polishing method employing it'2005 6,814,766'Polishing composition and polishing method employing it'2004 6,797,626'Method of polishing copper layer of substrate'2004 6,773,476'Polishing composition and polishing method employing it'2004 6,692,548'Copper-based sliding material, method of manufacturing the same, and sliding bearing'2004 6,679,929'Polishing composition and polishing method employing it'2004 6,652,675'Copper alloy sliding material'2003 6,602,615'Composite sliding material'2003 6,582,269'Lamp apparatus and lamp apparatus manufacturing method'2003 6,565,619'Polishing composition and polishing method employing it'2003 6,492,771'Bulb and a method for welding a pipe and a conductive wire thereof'2002 6,476,262'Urea synthesis process and apparatus'2002 6,475,635'Sliding material made of copper alloy, method of producing same, and sliding bearing'2002 6,440,186'Polishing composition and polishing method employing it'2002 6,402,589'Wafer grinder and method of detecting grinding amount'2002 6,354,914'Wafer polishing apparatus'2002 6,346,037'Wafer polishing machine'2002 6,334,914'Copper alloy sliding material'2002 6,302,762'Wafer polishing apparatus'2001 6,203,414'Polishing apparatus'2001 6,187,853'Process for the preparation of dispersions using viscosity-increase inhibitors of water-soluble polymers'2001 6,059,636'Wafer polishing apparatus'2000 6,027,398'Wafer polishing apparatus'2000 5,931,725'Wafer polishing machine'1999 5,922,640'Adsorbent for carbon monoxide'1999 5,876,272'Semiconductor wafer polishing machine'1999 5,607,703'Roller head extruder unit'1997 5,460,737'Graphite-free lubricating oil'1995 5,402,230'Heterodyne interferometric optical fiber displacement sensor for measuring displacement of an object'1995 5,346,668'Copper based alloy for wear resistant sliding layer and sliding member'1994 5,334,460'CU-PB system alloy composite bearing having overlay'1994 5,328,772'Multilayer sliding material for high-speed engine and method of producing same'1994 5,298,052'High temperature bearing alloy and method of producing the same'1994 5,178,712'Lamp device and method of bonding mirror reflector to lamp'1993 D0324055'Circular saw'1992 5,041,339'Multilayered sliding material of lead bronze containing graphite and method of manufacturing the same'1991 4,959,274'Multilayered iron-copper-lead alloy bearing material'1990 D0306031'Mitre saw'1990 4,844,642'Cap for writing equipment'1989 4,815,007'Apparatus for controlling a robot'1989 4,587,838'Automatic examination system for motor vehicles'1986 4,533,272'Writing instrument with movable closure'1985

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1985–2007Based in Aichi, JP· patent location history

1986–2009Based in Nagoya, JP· patent location history

1990–2005Patents assigned to DAIDO METAL CO (12)· patent assignee history

1990–1994Based in Ichinomiya, JP· patent location history

1995–2002Patents assigned to TOKYO SEIMITSU CO LTD (10)· patent assignee history

1995–2002Based in Mitaka, JP· patent location history

2002–2009Patents assigned to FUJIMI INC (11)· patent assignee history

2005–2019Based in Fukuoka, JP· patent location history

2012–2015Patents assigned to SAKAI KENJI (16)· patent assignee history

2012–2017Patents assigned to IBIDEN CO LTD (9)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SAKAI KENJIself	16	2012–2015
DAIDO METAL CO	12	1990–2005
FUJIMI INC	11	2002–2009
TOKYO SEIMITSU CO LTD	10	1995–2002
IBIDEN CO LTD	9	2012–2017

Locations

Location	Patents	Span
Mitaka, JP	10	1995–2002
Aichi, JP	9	1985–2007
Fukuoka, JP	8	2005–2019
Nagoya, JP	8	1986–2009
Ichinomiya, JP	6	1990–1994