Inventor
Sri Chaitra Jyotsna CHAVALI
Inventor
US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H01LSemiconductor devices36%
H01FMagnets7%
H01QAntennas, i.e. radio aerials5%
H05KPrinted circuits5%
H10DInorganic electric semiconductor devices5%
H01PWaveguides2%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
PatentTitleYear
12,592,334Stacked magnetic inductor and method202612,586,906Antenna package using ball attach array to connect antenna and base substrates202612,334,242Coreless electronic substrates having embedded inductors202512,261,124Embedded die architecture and method of making202512,132,015Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operations202412,062,551High density organic interconnect structures202412,033,930Selectively roughened copper architectures for low insertion loss conductive features202411,870,163Antenna package using ball attach array to connect antenna and base substrates202411,869,842Scalable high speed high bandwidth IO signaling package architecture and method of making202411,804,426Integrated circuit structures in package substrates202311,764,150Inductors for package substrates202311,721,632Hybrid core substrate architecture for high speed signaling and FLI/SLI reliability and its making202311,664,313Microelectronic device including fiber-containing build-up layers202311,631,595High density organic interconnect structures202311,276,634High density package substrate formed with dielectric bi-layer202211,195,727High density organic interconnect structures2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to INTEL CORP (16)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 16 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 16 | 2021–2026 |