LexDanaLexDanabeta
Inventor

Shinji Takeda

Inventor
Yokohama, JP

Overview

50→
Patents
1978–2013
Patent span
Electricity
Primary field (CPC H)

Patents· 50 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary
Y10TTechnical subjects covered by former us classification14%
H04WWireless communication networks12%
H04LTransmission of digital information, e.g. telegraphic communication10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
B29CShaping or joining of plastics4%
F16KValves4%
H04BTransmission3%
B82YSpecific uses or applications of nanostructures2%
PatentTitleYear
8,574,716'Ionic polymer devices and methods of fabricating the same'20138,233,443'Wireless communication apparatus and wireless communication method'20128,031,720'Packet transfer system, radio base station, and packet transfer route optimization method'20117,990,863'Channel allocation for access point in mesh network'20117,948,891'Wireless communication apparatus, communication routing control apparatus, communication routing control method and communication system'20117,907,890'Mobile communication system, transmitting station, receiving station, relay station, communication path determining method, and communication path determining program'20117,881,660'Mobile communication system, transmitting station, receiving station, relay station, communication path determining method, and communication path determining program'20117,876,619'Nonvolatile semiconductor memory device'20117,781,896'Semiconductor device and process for fabrication thereof'20107,751,360'Packet transmission system, wireless basestation, and route optimization for packet transmission'20107,738,374'Channel allocation for access point in mesh network'20107,720,466'Radio control station, radio terminal, base station, communication system, and communication method'20107,702,280'Mobile communication system, transmission station, reception station, relay station, communication path deciding method, and communication path deciding program'20107,620,010'Wireless communications apparatus, and routing control and packet transmission technique in wireless network'20097,619,998'Multi-hop communication system, radio control station, radio station and multi-hop communication method'20097,586,894'Communication system capable of selecting optimum gateway for terminals'20097,519,029'Radio communication system, base station, relay station, mobile station, and packet transmission control method'20097,387,914'Semiconductor device and process for fabrication thereof'20087,352,729'Wireless communication system for multi-hop connection, source station, radio station and pilot signal used therein'20087,273,652'Hollow carbon fiber and production method'20077,274,616'Integrated circuit apparatus'20077,116,592'Semiconductor device and test method thereof'20067,078,094'Semiconductor device and process for fabrication thereof'20067,057,265'Semiconductor device and process for fabrication thereof'20067,012,320'Semiconductor device and process for fabrication thereof'20066,855,579'Semiconductor device and process for fabrication thereof'20056,825,249'Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device'20046,754,836'Microcomputer capable of switching between low current consumption mode and normal operation mode'20046,743,500'Hollow carbon fiber and production method'20046,717,242'Semiconductor device and process for fabrication thereof'20046,641,792'Hollow carbon fiber and production method'20036,099,678'Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device'20006,014,318'Resin-sealed type ball grid array IC package and manufacturing method thereof'20005,667,899'Electrically conductive bonding films'19975,605,763'Electrically conductive bonding films'19975,401,878'Fluorine-containing polyimides and precursors thereof'19955,270,438'Fluorine-containing polyimides and precursors thereof'19935,243,019'Alkenyl-fluorine-containing aromatic polyamide'19935,042,871'Glass pane for use in a vehicle'19914,960,262'Ball valve and methods of fabrication'19904,883,253'Ball valve and methods of fabrication'19894,869,450'Ball valve'19894,813,649'Ball valve'19894,737,090'Movable vane compressor'19884,667,926'Ball valve'19874,579,755'Longitudinal molding with nonuniform sections'19864,489,019'Method for producing a longitudinal molding with nonuniform sections'19844,450,038'Hot air blast welding apparatus for thermoplastic parts'19844,094,056'Decorative trim strip'19784,094,725'Apparatus for hot gas welding of a pair of thermoplastic materials'1978

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1978–1991Patents assigned to AISIN SEIKI (6)· patent assignee history
1978–1991Based in Toyota, JP· patent location history
1987–1990Patents assigned to SEIKISUI CHEMICAL CO LTD (5)· patent assignee history
1987–1990Based in Saitama, JP· patent location history
1993–2013Patents assigned to HITACHI CHEMICAL CO LTD (18)· patent assignee history
1993–2010Based in Tsukuba, JP· patent location history
2000–2007Based in Tokyo, JP· patent location history
2006–2012Based in Yokohama, JP· patent location history
2008–2012Patents assigned to NTT DOCOMO INC (15)· patent assignee history
2012–2013Patents assigned to TAKEDA SHINJI (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HITACHI CHEMICAL CO LTD181993–2013
NTT DOCOMO INC152008–2012
AISIN SEIKI61978–1991
SEIKISUI CHEMICAL CO LTD51987–1990
TAKEDA SHINJIself22012–2013
Locations
LocationPatentsSpan
Yokohama, JP152006–2012
Tsukuba, JP131993–2010
Tokyo, JP52000–2007
Toyota, JP51978–1991
Saitama, JP31987–1990