Inventor
Motoshu Miyajima
Inventor
Kawasaki, JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10DInorganic electric semiconductor devices17%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
B23KSoldering or unsoldering6%
B24BMachines, devices, or processes for grinding or polishing6%
H05KPrinted circuits6%
PatentTitleYear
7,416,985'Semiconductor device having a multilayer interconnection structure and fabrication method thereof'20086,943,115'Semiconductor device and method of manufacture thereof'20056,732,911'Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system'20046,686,285'Semiconductor device manufacture method preventing dishing and erosion during chemical mechanical polishing'20046,326,309'Semiconductor device manufacturing method'20015,376,222'Polishing method for polycrystalline silicon'19944,824,794'Method for fabricating a bipolar transistor having self aligned base and emitter'19894,579,625'Method of producing a complementary semiconductor device with a dielectric isolation structure'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–2008Patents assigned to FUJITSU LTD (8)· patent assignee history
1986–2008Based in Kawasaki, JP· patent location history
2001Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 8 | 1986–2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 7 | 1986–2008 |
| Kanagawa, JP | 1 | 2001 |