Inventor
Cha-Jea Jo
Inventor
Yongin-si, KR
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
H01LSemiconductor devices30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10DInorganic electric semiconductor devices4%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
G02BOptical elements, systems or apparatus3%
B05DProcesses for applying fluent materials to surfaces, in general1%
C23CCoating metallic material1%
H01BCables1%
H04NPictorial communication, e.g. television1%
PatentTitleYear
10,867,970Semiconductor package202010,750,112Substrate structures for image sensor modules and image sensor modules including the same202010,680,025Semiconductor package and image sensor202010,658,341Semiconductor package202010,535,534Method of fabricating an interposer202010,483,150Apparatus for stacking semiconductor chips in a semiconductor package201910,373,935Semiconductor package201910,224,272Semiconductor package including a rewiring layer with an embedded chip201910,141,286Methods of manufacturing semiconductor packages201810,134,702Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip201810,083,939Semiconductor package201810,026,724Semiconductor package and method of manufacturing the same20189,997,446Semiconductor package including a rewiring layer with an embedded chip20189,728,424'Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate'20179,666,551'Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip'20179,618,716'Photonic integrated circuit'20179,589,945'Semiconductor package having stacked semiconductor chips'20179,543,231'Stacked semiconductor package'20179,159,659'Semiconductor package and method of manufacturing the semiconductor package'20158,980,689'Method of fabricating semiconductor multi-chip stack packages'20158,912,048'Method of fabricating semiconductor device including a substrate attached to a carrier'20148,723,315'Flip chip package'20148,178,969'Flip chip package'20128,088,648'Method of manufacturing a chip stack package'20127,638,365'Stacked chip package and method for forming the same'20097,626,260'Stack-type semiconductor device having cooling path on its bottom surface'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (26)· patent assignee history
2009Based in Gyeonggi-do, KR· patent location history
2012–2017Patents assigned to JO CHA-JEA (4)· patent assignee history
2012–2014Patents assigned to HWANG TAE-JOO (2)· patent assignee history
2012–2014Patents assigned to LEE JONG-JOO (2)· patent assignee history
2012–2015Based in Bucheon-si, KR· patent location history
2012Based in Suwon-si, KR· patent location history
2017Patents assigned to CHO TAE-JE (1)· patent assignee history
2017–2020Based in Yongin-si, KR· patent location history
2017Based in Incheon, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 26 | 2009–2020 |
| JO CHA-JEAself | 4 | 2012–2017 |
| HWANG TAE-JOO | 2 | 2012–2014 |
| LEE JONG-JOO | 2 | 2012–2014 |
| CHO TAE-JE | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yongin-si, KR | 14 | 2017–2020 |
| Bucheon-si, KR | 5 | 2012–2015 |
| Incheon, KR | 4 | 2017 |
| Gyeonggi-do, KR | 2 | 2009 |
| Suwon-si, KR | 1 | 2012 |