Inventor
Tokuhisa Ohiwa
Inventor
Kawasaki, JP
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1031%
H01JElectric discharge tubes or discharge lamps16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
C23CCoating metallic material6%
H10DInorganic electric semiconductor devices6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
G01BMeasuring length, thickness or similar linear dimensions4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
H10BElectronic memory devices4%
B08BCleaning in general3%
PatentTitleYear
9,177,781'Plasma processing method and manufacturing method of semiconductor device'20159,126,229'Deposit removal method'20158,513,134'Semiconductor device producing method'20138,487,365'Semiconductor device and method for manufacturing same'20138,211,783'Method for manufacturing semiconductor device including a patterned SiOC film as a mask'20127,767,582'Method of manufacturing semiconductor device'20107,767,055'Capacitive coupling plasma processing apparatus'20107,628,931'Processing method for conservation of processing gases'20097,595,885'Process monitoring system, process monitoring method, and method for manufacturing semiconductor device'20097,349,088'Process monitoring system, process monitoring method, and method for manufacturing semiconductor device'20087,327,455'Process monitoring system, process monitoring method, and method for manufacturing semiconductor device'20087,285,498'Etching method'20077,182,879'Plasma processing method'20077,045,462'Method for fabricating a pattern and method for manufacturing a semiconductor device'20067,022,616'High speed silicon etching method'20066,911,398'Method of sequentially processing a plurality of lots each including semiconductor substrates'20056,887,802'Method of manufacturing semiconductor device and semiconductor device'20056,846,750'High precision pattern forming method of manufacturing a semiconductor device'20056,782,907'Gas recirculation flow control method and apparatus for use in vacuum system'20046,780,278'Plasma processing apparatus with reduced parasitic capacity and loss in RF power'20046,689,699'Method for manufacturing a semiconductor device using recirculation of a process gas'20046,576,562'Manufacturing method of semiconductor device using mask pattern having high etching resistance'20036,433,297'Plasma processing method and plasma processing apparatus'20026,420,271'Method of forming a pattern'20026,369,423'Semiconductor device with a thin gate stack having a plurality of insulating layers'20026,274,512'Method for manufacturing a semiconductor device'20015,998,100'Fabrication process using a multi-layer antireflective layer'19995,874,363'Polycide etching with HCL and chlorine'19995,759,746'Fabrication process using a thin resist'19985,756,402'Method of etching silicon nitride film'19985,658,389'Thin film forming method and apparatus'19975,310,454'Dry etching method'19945,094,879'Method of activating at least one gas to produce different charged species, selecting specific species, decelerating the species, and chemically reacting the species to form a thin film'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2015Patents assigned to TOSHIBA KK (32)· patent assignee history
1994–2009Based in Kanagawa, JP· patent location history
1998–2002Patents assigned to IBM (3)· patent assignee history
1998–1999Based in Fishkill, NY, US· patent location history
2001–2010Based in Kawasaki, JP· patent location history
2009–2015Patents assigned to TOKYO ELECTRON LTD (4)· patent assignee history
2012–2015Patents assigned to OHIWA TOKUHISA (5)· patent assignee history
2012–2013Based in Mie, JP· patent location history
2013–2015Patents assigned to OMURA MITSUHIRO (3)· patent assignee history
2013–2015Based in Yokkaichi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 32 | 1992–2015 |
| OHIWA TOKUHISAself | 5 | 2012–2015 |
| TOKYO ELECTRON LTD | 4 | 2009–2015 |
| IBM | 3 | 1998–2002 |
| OMURA MITSUHIRO | 3 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 14 | 2001–2010 |
| Kanagawa, JP | 8 | 1994–2009 |
| Fishkill, New York, US | 3 | 1998–1999 |
| Yokkaichi, JP | 2 | 2013–2015 |
| Mie, JP | 2 | 2012–2013 |