Inventor
Ma. Fatima Seijo
Inventor
Hayward, CA, US
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C11Dprimary
C11DDetergent compositions22%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
C09KMaterials for miscellaneous applications, not provided for elsewhere12%
C23GCleaning or de-greasing of metallic material by chemical methods other than electrolysis12%
C23FNon-mechanical removal of metallic material from surface6%
H01LSemiconductor devices2%
PatentTitleYear
9,109,188'Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate'20157,662,762'Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates'20107,605,113'Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate'20097,534,752'Post plasma ashing wafer cleaning formulation'20096,967,169'Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate'20056,896,826'Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate'20056,773,873'pH buffered compositions useful for cleaning residue from semiconductor substrates'20046,755,989'Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate'20046,660,700'Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures'20036,566,315'Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures'20036,344,432'Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2015Patents assigned to ADVANCED TECH MATERIALS (10)· patent assignee history
2002–2015Based in Hayward, CA, US· patent location history
2003Patents assigned to ADVANCED TECHNOLOGIES MATERIAL (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED TECH MATERIALS | 10 | 2002–2015 |
| ADVANCED TECHNOLOGIES MATERIAL | 1 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hayward, California, US | 11 | 2002–2015 |