Inventor
MARK BOHR
Inventor
US
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices34%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10DInorganic electric semiconductor devices18%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use4%
B82YSpecific uses or applications of nanostructures2%
G01RMeasuring electric variables2%
PatentTitleYear
12,519,058Device layer interconnects202612,278,144Gate contact structure over active gate and method to fabricate same202512,100,705Deep trench via for three-dimensional integrated circuit202411,978,727Package on active silicon semiconductor packages202411,881,452Device layer interconnects202411,830,829Device, system and method for providing inductor structures202311,749,663Device, method and system for providing a stacked arrangement of integrated circuit dies202311,652,107Substrate-less FinFET diode architectures with backside metal contact and subfin regions202311,652,060Die interconnection scheme for providing a high yielding process for high performance microprocessors202311,563,081Self-aligned gate edge and local interconnect202311,462,536Integrated circuit structures having asymmetric source and drain structures202211,410,928Device layer interconnects202211,387,198Device, system and method for providing inductor structures202211,373,999Deep trench via for three-dimensional integrated circuit202211,373,987Device, method and system for providing a stacked arrangement of integrated circuit dies202211,249,113High density and fine pitch interconnect structures in an electric test apparatus202211,201,129Designs and methods for conductive bumps2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to INTEL CORP (17)· patent assignee history
2021–2026Based in US· patent location history
2023Patents assigned to DAEDALUS PRIME LLC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 17 | 2021–2026 |
| DAEDALUS PRIME LLC | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 17 | 2021–2026 |