Inventor
Makoto Kanda
Inventor
Tokyo, JP
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
B23KSoldering or unsoldering7%
H01JElectric discharge tubes or discharge lamps7%
B29CShaping or joining of plastics5%
G01RMeasuring electric variables5%
H05KPrinted circuits5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
Y10TTechnical subjects covered by former us classification5%
PatentTitleYear
10,921,767Encoder system202110,789,144Supervisory circuit, supervisory system, motor control system20207,794,299'Method for manufacturing image display device, image display device, and TV apparatus'20107,544,522'Fabrication method of semiconductor integrated circuit device'20097,390,235'Method for manufacturing image display device, image display device, and TV apparatus'20087,088,036'Method for manufacturing image display device, image display device, and TV apparatus'20067,005,741'Liquid crystal display device and/or circuit substrate including bump electrodes and electrode pads'20066,998,295'Method of manufacturing a device package'20066,933,607'Semiconductor device with bumps on electrode pads oriented in given direction'20056,901,093'Semiconductor laser device'20056,760,001'Method of adjusting characteristics of electron source, method of manufacturing electron emission device'20046,611,504'Mobile wireless device'20036,525,422'Semiconductor device including bump electrodes'20036,452,281'Semiconductor integrated circuit and fabrication process therefor'20026,281,510'Sample transferring method and sample transfer supporting apparatus'20016,213,356'Bump forming apparatus and bump forming method'20016,090,176'Sample transferring method and sample transfer supporting apparatus'20005,302,801'Laser bonding apparatus'19945,250,781'Laser bonding apparatus'19935,009,590'Method and apparatus for preheating semiconductor chips'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2006Patents assigned to MITSUBISHI ELECTRIC CORP (6)· patent assignee history
1991–1994Based in Fukuoka, JP· patent location history
2000–2021Patents assigned to TOSHIBA KK (4)· patent assignee history
2000–2001Based in Kumamoto, JP· patent location history
2001–2010Based in Tokyo, JP· patent location history
2002–2006Patents assigned to SHARP KK (4)· patent assignee history
2003–2006Based in Kashihara, JP· patent location history
2003–2021Based in Kanagawa, JP· patent location history
2004–2010Patents assigned to CANON KK (4)· patent assignee history
2020–2021Patents assigned to TOSHIBA ELECTRONIC DEVICES & STORAGE CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 6 | 1991–2006 |
| CANON KK | 4 | 2004–2010 |
| SHARP KK | 4 | 2002–2006 |
| TOSHIBA KK | 4 | 2000–2021 |
| TOSHIBA ELECTRONIC DEVICES & STORAGE CORP | 2 | 2020–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 8 | 2001–2010 |
| Kashihara, JP | 3 | 2003–2006 |
| Fukuoka, JP | 3 | 1991–1994 |
| Kanagawa, JP | 2 | 2003–2021 |
| Kumamoto, JP | 2 | 2000–2001 |