Inventor
Takuya Miyamoto
Inventor
Osaka, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G03Gprimary
G03GElectrography57%
B29CShaping or joining of plastics14%
H01LSemiconductor devices14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
PatentTitleYear
10,838,338Image forming apparatus including a chipped part to block the transmission of heat20209,946,186Image forming apparatus including unit attachable to and detachable from apparatus main body, conductive member disposed in unit, contact spring disposed in apparatus main body and configured to come in electrically conductive contact with conductive member, and hollow cylinder disposed in apparatus main body and retaining contact spring20189,927,766'Removable unit and image forming apparatus therewith'20189,921,545'Unit detachable along an insertion/removal trajectory formed in an image forming apparatus main body, and image forming apparatus therewith'20189,238,314'Method for resin molding and resin molding apparatus'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016Patents assigned to APIC YAMADA CORP (1)· patent assignee history
2016Based in Chikuma, JP· patent location history
2018–2020Patents assigned to KYOCERA DOCUMENT SOLUTIONS INC (4)· patent assignee history
2018–2020Based in Osaka, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KYOCERA DOCUMENT SOLUTIONS INC | 4 | 2018–2020 |
| APIC YAMADA CORP | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 4 | 2018–2020 |
| Chikuma, JP | 1 | 2016 |