Inventor
CHENG-HSIEN CHOU
Inventor
TW
Overview
Patents· 74 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices17%
F04BPositive-displacement machines for liquids13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation9%
B29CShaping or joining of plastics5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B60SServicing, cleaning, repairing, supporting, lifting, or manoeuvring of vehicles, not otherwise provided for5%
H10DInorganic electric semiconductor devices4%
B29LIndexing scheme associated with subclass b29c, relating to particular articles4%
B60CVehicle tyres4%
PatentTitleYear
12,595,786Air compressor structure202612,590,579Portable blowing and suction air compressor202612,543,395Semiconductor structure and method of manufacturing the same202612,504,008Air compressor2025D1104070Air compressor202512,484,325Absorption enhancement structure to increase quantum efficiency of image sensor202512,473,902Air compressor structure202512,451,391Image sensor with dual trench isolation structure202512,433,059Composite etch stop layers for sensor devices2025D1092566Air compressor202512,397,517Vehicle-mounted air compressor2025D1084841Cap2025D1084840Cap202512,343,950Tire repairing device and glue applicator202512,293,946Techniques for wafer stack processing202512,266,579Method and system for adjusting the gap between a wafer and a top plate in a thin-film deposition process202512,237,165Method for wafer bonding including edge trimming202512,215,681Air stop sheet of piston of cylinder202512,211,741Multi-wafer capping layer for metal arcing protection202512,199,120Image sensor scheme for optical and electrical improvement202512,183,761Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same202412,176,372Dielectric structure overlying image sensor element to increase quantum efficiency202412,125,763Trim wall protection method for multi-wafer stacking2024D1044876Air compressor2024D1043760Air compressor202412,087,756Protective wafer grooving structure for wafer thinning and methods of using the same202412,087,801Deep trench isolations and methods of forming the same2024D1040862Air compressor202412,021,334Cigarette lighter plug of automobile tire repairing device202412,002,828Absorption enhancement structure to increase quantum efficiency of image sensor202411,984,4313DIC structure and methods of forming202411,971,027Air compressor202411,920,586Fixing device of motor of air compressor202411,913,440Fixing device of motor of air compressor202411,905,945Piston of air compressor202411,862,515Multi-wafer capping layer for metal arcing protection202411,828,278Air compressor202311,815,080Piston of cylinder of air compressor202311,767,836Air compressor202311,761,437Piston of air compressor202311,749,760Composite etch stop layers for sensor devices202311,745,451Device of inflating and repairing broken tire and method of using the same202311,735,617Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same202311,715,674Trim wall protection method for multi-wafer stacking202311,705,360Image sensor with dual trench isolation structure202311,705,470Image sensor scheme for optical and electrical improvement202311,682,652Notched wafer and bonding support structure to improve wafer stacking202311,670,539Method of making a semiconductor arrangement202311,664,411Semiconductor structure having integrated inductor therein2023D0985623Air compressor202311,609,138Air compressor having pressure gauge202311,610,812Multi-wafer capping layer for metal arcing protection202311,609,140Display structure of pressure gauge of air compressor202311,600,647Absorption enhancement structure to increase quantum efficiency of image sensor202311,587,9083DIC structure and methods of forming202311,548,333Check joint structure for connection of air nozzle of tire and connection hose of air compressor202311,552,066Protective wafer grooving structure for wafer thinning and methods of using the same202311,545,395Techniques for wafer stack processing202311,391,640Connection assembly for body and casing of a pressure gauge202211,371,901Pressure gauge capable of releasing pressure safely202211,372,282Backlight module and display device202211,374,046Semiconductor structure and method of manufacturing the same202211,358,351Anti-spray joint structure of connection hose of vehicle air compressor202211,335,817Composite etch stop layers for sensor devices202211,235,629Anti-jet joint structure of connection hose of vehicle air compressor202211,217,621Deep trench isolations and methods of forming the same202211,204,023Positioning structure of motor of air compressor202111,193,475Connection structure for motor of air compressor202111,189,583Semiconductor structure and manufacturing method thereof202111,149,892Check structure for connection of air nozzle of tire and connection hose of air compressor202111,152,276Trim wall protection method for multi-wafer stacking202111,148,376Air compressor capable of inflating air and supplying sealant202111,143,346Check joint structure for connection of an air nozzle of a tire and a connector of a connection hose of an air compressor202111,139,210Bonding support structure (and related process) for wafer stacking2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (36)· patent assignee history
2021–2025Patents assigned to CHOU CHENG HSIEN (26)· patent assignee history
2021–2025Patents assigned to CHOU WEN SAN (26)· patent assignee history
2021–2026Based in TW· patent location history
2022Patents assigned to CORETRONIC CORP (1)· patent assignee history
2023–2026Patents assigned to UNIK WORLD IND CO LTD (11)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 36 | 2021–2026 |
| CHOU CHENG HSIENself | 26 | 2021–2025 |
| CHOU WEN SAN | 26 | 2021–2025 |
| UNIK WORLD IND CO LTD | 11 | 2023–2026 |
| CORETRONIC CORP | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 74 | 2021–2026 |