Inventor
SANGWOO PAE
Inventor
KR
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H10DInorganic electric semiconductor devices20%
H05KPrinted circuits7%
H10BElectronic memory devices7%
PatentTitleYear
12,568,822Semiconductor module including a clip structure202612,501,608Semiconductor device having different extending active layers202511,961,824Semiconductor package including stacked chip structure202411,735,491Semiconductor package device202311,637,065Semiconductor device including via and wiring202311,239,162Semiconductor device including via and wiring2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (6)· patent assignee history
2022–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 6 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 6 | 2022–2026 |