Inventor
Tomohiro Ohta
Inventor
Chiba, JP
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
C23CCoating metallic material17%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
Y10TTechnical subjects covered by former us classification4%
A62CFire-fighting2%
G08BSignalling systems, e.g. personal calling systems2%
G11CStatic stores2%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
7,476,619'Semiconductor device'20096,747,748'Manufacturing method for a field-effect transistor, manufacturing method for a semiconductor device, and apparatus therefor'20046,063,703'Method for making metal interconnection'20006,001,736'Method of manufacturing semiconductor device and an apparatus for manufacturing the same'19995,998,522'Coating solution and method for preparing the coating solution, method for forming insulating films for semiconductor devices, and method for evaluating the coating solution'19995,973,402'Metal interconnection and method for making'19995,952,723'Semiconductor device having a multilevel interconnection structure'19995,946,799'Multilevel interconnect method of manufacturing'19995,840,821'Coating solution and method for preparing the coating solution, method for forming insulating films for semiconductor devices, and method for evaluating the coating solution'19985,679,974'Antifuse element and semiconductor device having antifuse elements'19975,652,180'Method of manufacturing semiconductor device with contact structure'19975,641,985'Antifuse element and semiconductor device having antifuse elements'19975,637,534'Method of manufacturing semiconductor device having multilevel interconnection structure'19975,627,102'Method for making metal interconnection with chlorine plasma etch'19975,627,345'Multilevel interconnect structure'19975,605,867'Method of manufacturing insulating film of semiconductor device and apparatus for carrying out the same'19975,565,702'Antifuse element, semiconductor device having antifuse elements, and method for manufacturing the same'19965,552,181'Method for supplying liquid material and process for forming thin films using the liquid material supplying method'19965,532,191'Method of chemical mechanical polishing planarization of an insulating film using an etching stop'19965,521,423'Dielectric structure for anti-fuse programming element'19965,486,492'Method of forming multilayered wiring structure in semiconductor device'19965,308,651'Photochemical vapor deposition process'19945,305,519'Multilevel interconnect structure and method of manufacturing the same'19945,300,321'Process for depositing titanium nitride film by CVD'19945,290,736'Method of forming interlayer-insulating film using ozone and organic silanes at a pressure above atmospheric'19945,225,245'Chemical vapor deposition method for forming thin film'19935,209,182'Chemical vapor deposition apparatus for forming thin film'19935,117,916'Sprinkler head and operation monitor therefor'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992Patents assigned to HOCHIKI CO (1)· patent assignee history
1993–2000Patents assigned to KAWASAKI STEEL CO (25)· patent assignee history
1993–2000Based in Chiba, JP· patent location history
1996–1999Based in Urayasu, JP· patent location history
1999–2009Patents assigned to TOKYO ELECTRON LTD (3)· patent assignee history
1999Based in Tokyo, JP· patent location history
2004Based in Yamanashi, JP· patent location history
2009Based in Nirasaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KAWASAKI STEEL CO | 25 | 1993–2000 |
| TOKYO ELECTRON LTD | 3 | 1999–2009 |
| HOCHIKI CO | 1 | 1992 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chiba, JP | 20 | 1993–2000 |
| Urayasu, JP | 4 | 1996–1999 |
| Nirasaki, JP | 1 | 2009 |
| Yamanashi, JP | 1 | 2004 |
| Tokyo, JP | 1 | 1999 |