Inventor
Jeffry J. Sniegowski
Inventor
Edgewood, NM, US
Overview
Patents· 44 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices13%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems10%
Y10TTechnical subjects covered by former us classification9%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering7%
G02BOptical elements, systems or apparatus7%
H02NElectric machines not otherwise provided for6%
A61FFilters implantable into blood vessels5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
H01HElectric switches3%
PatentTitleYear
10,217,704Method for simultaneous modification of multiple semiconductor device features20199,076,612'Integrating impact switch'20158,809,706'Integrating impact switch'20148,507,813'Integrating impact switch'20137,992,309'Micromachined cutting blade formed from {211}-oriented silicon'20117,544,176'Glaucoma implant having MEMS flow module with flexing diaphragm for pressure regulation'20097,384,550'Glaucoma implant having MEMS filter module'20087,364,564'Implant having MEMS flow module with movable, flow-controlling baffle'20087,226,540'MEMS filter module'20077,060,081'Microkeratome blade with arbitrary blade angle'20067,055,975'Microelectromechanical system with non-collinear force compensation'20066,989,582'Method for making a multi-die chip'20066,847,152'Microelectromechnical system for tilting a platform'20056,831,391'Microelectromechanical system for tilting a platform'20046,808,952'Process for fabricating a microelectromechanical structure'20046,794,793'Microelectromechnical system for tilting a platform'20046,791,730'Surface micromachined optical system with reinforced mirror microstructure'20046,778,305'Surface micromachined optical system with reinforced mirror microstructure'20046,778,306'Surface micromachined optical system with reinforced mirror microstructure'20046,774,535'Micromechanical platform pivotal on a compliant member'20046,759,787'Microelectromechanical apparatus for elevating and tilting a platform'20046,756,317'Method for making a microstructure by surface micromachining'20046,665,104'Mirror positioning assembly with vertical force component compensation'20036,649,947'Surface-micromachined rotatable member having a low-contact-area hub'20036,640,023'Single chip optical cross connect'20036,615,496'Micromachined cutting blade formed from 211-oriented silicon'20036,600,587'Surface micromachined optical system with reinforced mirror microstructure'20036,545,385'Microelectromechanical apparatus for elevating and tilting a platform'20036,402,969'Surfacemicromachined rotatable member having a low-contact-area hub'20026,350,015'Magnetic drive systems and methods for a micromachined fluid ejector'20026,290,859'Tungsten coating for improved wear resistance and reliability of microelectromechanical devices'20016,174,820'Use of silicon oxynitride as a sacrificial material for microelectromechanical devices'20016,082,208'Method for fabricating five-level microelectromechanical structures and microelectromechanical transmission formed'20005,920,067'Monocrystalline test and reference structures, and use for calibrating instruments'19995,804,084'Use of chemical mechanical polishing in micromachining'19985,798,283'Method for integrating microelectromechanical devices with electronic circuitry'19985,783,340'Method for photolithographic definition of recessed features on a semiconductor wafer utilizing auto-focusing alignment'19985,684,301'Monocrystalline test structures, and use for calibrating instruments'19975,649,423'Micromechanism linear actuator with capillary force sealing'19975,631,514'Microfabricated microengine for use as a mechanical drive and power source in the microdomain and fabrication process'19975,339,051'Micro-machined resonator oscillator'19945,188,983'Polysilicon resonating beam transducers and method of producing the same'19935,090,254'Polysilicon resonating beam transducers'19925,013,693'Formation of microstructures with removal of liquid by freezing and sublimation'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–1993Patents assigned to WISCONSIN ALUMNI RES FOUND (3)· patent assignee history
1991Based in Madison, WI, US· patent location history
1992–1993Based in Oregon, WI, US· patent location history
1994–2011Patents assigned to SANDIA CORP (15)· patent assignee history
1994–2004Based in Albuquerque, NM, US· patent location history
2000–2005Based in Edgewood, NM, US· patent location history
2003–2006Patents assigned to MEMX INC (13)· patent assignee history
2003–2019Based in Tijeras, NM, US· patent location history
2007–2009Patents assigned to BECTON DICKINSON CO (4)· patent assignee history
2013–2015Patents assigned to HT MICROANALYTICAL INC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SANDIA CORP | 15 | 1994–2011 |
| MEMX INC | 13 | 2003–2006 |
| BECTON DICKINSON CO | 4 | 2007–2009 |
| HT MICROANALYTICAL INC | 3 | 2013–2015 |
| WISCONSIN ALUMNI RES FOUND | 3 | 1991–1993 |
Locations
| Location | Patents | Span |
|---|---|---|
| Edgewood, NM, US | 19 | 2000–2005 |
| Tijeras, NM, US | 13 | 2003–2019 |
| Albuquerque, NM, US | 9 | 1994–2004 |
| Oregon, WI, US | 2 | 1992–1993 |
| Madison, WI, US | 1 | 1991 |