Inventor
Hideki Gomi
Inventor
Tokyo, JP
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices22%
G11CStatic stores17%
H01LSemiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
C23CCoating metallic material4%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
11,004,494Memory arrays, and methods of forming memory arrays202110,242,726Memory arrays, and methods of forming memory arrays201910,153,027Memory arrays, and methods of forming memory arrays201810,083,734Memory arrays20187,763,500'Method for manufacturing semiconductor storage device comprising a slow cooling step'20106,368,412'Apparatus with high temperature gas releasing means for vapor deposition of parylene polymer without peeling'20026,130,171'Residue removal process for forming inter-level insulating layer of paraylene polymer without peeling'20005,288,325'Chemical vapor deposition apparatus'19945,189,502'Semiconductor device having ventilative insulating films'19934,907,064'Semiconductor device having silicon oxynitride film with improved moisture resistance'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–2002Patents assigned to NEC CORP (5)· patent assignee history
1990–2010Based in Tokyo, JP· patent location history
2010Patents assigned to ELPIDA MEMORY INC (1)· patent assignee history
2018–2021Patents assigned to MICRON TECHNOLOGY INC (4)· patent assignee history
2018–2021Based in Boise, ID, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NEC CORP | 5 | 1990–2002 |
| MICRON TECHNOLOGY INC | 4 | 2018–2021 |
| ELPIDA MEMORY INC | 1 | 2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 6 | 1990–2010 |
| Boise, ID, US | 4 | 2018–2021 |