Inventor
Jay D. Pinson, II
Inventor
San Jose, CA, US
Overview
Patents· 46 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
H01JElectric discharge tubes or discharge lamps14%
C23CCoating metallic material10%
H01FMagnets6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
G05BControl or regulating systems in general5%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them5%
G03DApparatus for processing exposed photographic materials5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
PatentTitleYear
10,984,990Electrode assembly202110,934,620Integration of dual remote plasmas sources for flowable CVD202110,916,407Conditioning remote plasma source for enhanced performance having repeatable etch and deposition rates202110,663,491Voltage-current probe for measuring radio-frequency electrical power in a high-temperature environment and method of calibrating the same202010,580,623Plasma processing using multiple radio frequency power feeds for improved uniformity202010,510,567Integrated substrate temperature measurement on high temperature ceramic heater201910,428,426Method and apparatus to prevent deposition rate/thickness drift, reduce particle defects and increase remote plasma system lifetime201910,403,535Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system201910,388,549On-board metrology (OBM) design and implication in process tool201910,192,717Conditioning remote plasma source for enhanced performance having repeatable etch and deposition rates201910,113,236Batch curing chamber with gas distribution and individual pumping201810,083,818Auto frequency tuned remote plasma source20189,466,469'Remote plasma source for controlling plasma skew'20169,305,749'Methods of directing magnetic fields in a plasma source, and associated systems'20169,285,168'Module for ozone cure and post-cure moisture treatment'20168,771,538'Plasma source design'20148,742,665'Plasma source design'20148,550,031'Cluster tool architecture for processing a substrate'20138,524,004'Loadlock batch ozone cure'20138,215,262'Cluster tool architecture for processing a substrate'20128,181,596'Cluster tool architecture for processing a substrate'20128,146,530'Cluster tool architecture for processing a substrate'20127,925,377'Cluster tool architecture for processing a substrate'20117,819,079'Cartesian cluster tool configuration for lithography type processes'20107,743,728'Cluster tool architecture for processing a substrate'20107,694,647'Cluster tool architecture for processing a substrate'20107,415,981'Filter pad and protective hood'20087,357,842'Cluster tool architecture for processing a substrate'20086,887,124'Method of polishing and cleaning substrates'20056,545,420'Plasma reactor using inductive RF coupling, and processes'20036,518,195'Plasma reactor using inductive RF coupling, and processes'20036,488,807'Magnetic confinement in a plasma reactor having an RF bias electrode'20026,413,145'System for polishing and cleaning substrates'20026,251,792'Plasma etch processes'20016,251,001'Substrate polishing with reduced contamination'20016,244,931'Buffer station on CMP system'20016,182,602'Inductively coupled HDP-CVD reactor'20016,083,344'Multi-zone RF inductively coupled source configuration'20006,068,784'Process used in an RF coupled plasma reactor'20006,053,801'Substrate polishing with reduced contamination'20005,574,410'Electronically tuned matching networks using adjustable inductance elements and resonant tank circuits'19965,572,170'Electronically tuned matching networks using adjustable inductance elements and resonant tank circuits'19965,556,501'Silicon scavenger in an inductively coupled RF plasma reactor'19965,392,018'Electronically tuned matching networks using adjustable inductance elements and resonant tank circuits'19955,187,454'Electronically tuned matching network using predictor-corrector control system'19934,411,023'Smoke protective hood'1983Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1983–2013Patents assigned to PINSON JAY D (5)· patent assignee history
1983–2021Based in San Jose, CA, US· patent location history
1993–2021Patents assigned to APPLIED MATERIALS INC (43)· patent assignee history
2012–2013Patents assigned to ARMER HELEN R (4)· patent assignee history
2012–2013Patents assigned to BACKER JOHN A (4)· patent assignee history
2012–2013Patents assigned to CARLSON CHARLES (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 43 | 1993–2021 |
| PINSON JAY Dself | 5 | 1983–2013 |
| ARMER HELEN R | 4 | 2012–2013 |
| BACKER JOHN A | 4 | 2012–2013 |
| CARLSON CHARLES | 4 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 46 | 1983–2021 |