Inventor
ERIC R. MILLER
Inventor
US
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
B41JTypewriters12%
H10DInorganic electric semiconductor devices12%
F16KValves9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
C23CCoating metallic material5%
C25DProcesses for the electrolytic or electrophoretic production of coatings5%
H05KPrinted circuits4%
H10NElectric solid-state devices not otherwise provided for4%
PatentTitleYear
12,402,403Air gap spacer for metal gates202512,305,310Indium electroplating on physical vapor deposition tantalum202512,166,110Nanosheet channel-to-source and drain isolation202412,148,721Iterative formation of damascene interconnects202411,975,539Systems and methods for controlling operation of micro-valves for use in jetting assemblies202411,938,733Systems and methods for sealing micro-valves for use in jetting assemblies202411,869,936Semiconductor device and method of forming the semiconductor device202411,869,937Semiconductor device and method of forming the semiconductor device202411,794,476Micro-valves for use in jetting assemblies202311,753,736Indium electroplating on physical vapor deposition tantalum202311,710,756Integrating optical elements with electro-optical sensors via direct-bond hybridization202311,660,861Systems and methods for controlling operation of micro-valves for use in jetting assemblies202311,652,161Nanosheet channel-to-source and drain isolation202311,639,057Methods of fabricating micro-valves and jetting assemblies including such micro-valves202311,557,589Air gap spacer for metal gates202311,479,041Systems and methods for sealing micro-valves for use in jetting assemblies202211,430,753Iterative formation of damascene interconnects202211,239,316Semiconductor device and method of forming the semiconductor device202211,222,813Method of manufacturing wafer level low melting temperature interconnections202211,186,084Electrode structures for micro-valves for use in jetting assemblies2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to MATTHEWS INT CORP (7)· patent assignee history
2021–2025Based in US· patent location history
2022–2025Patents assigned to RAYTHEON CO (6)· patent assignee history
2022–2024Patents assigned to IBM (3)· patent assignee history
2023Patents assigned to TESSERA LLC (2)· patent assignee history
2024–2025Patents assigned to ADEIA SEMICONDUCTOR SOLUTIONS LLC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATTHEWS INT CORP | 7 | 2021–2024 |
| RAYTHEON CO | 6 | 2022–2025 |
| IBM | 3 | 2022–2024 |
| ADEIA SEMICONDUCTOR SOLUTIONS LLC | 2 | 2024–2025 |
| TESSERA LLC | 2 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 20 | 2021–2025 |