Inventor
Mitsuhiko Shirakashi
Inventor
Tokyo, JP
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
B24BMachines, devices, or processes for grinding or polishing16%
C25FProcesses for the electrolytic removal of materials from objects16%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool14%
B08BCleaning in general9%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry4%
C25DProcesses for the electrolytic or electrophoretic production of coatings4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B01FMixing, e.g. dissolving, emulsifying or dispersing2%
H01LSemiconductor devices2%
PatentTitleYear
9,287,158'Substrate processing apparatus'20168,133,380'Method for regenerating ion exchanger'20128,029,333'Device for polishing peripheral edge of semiconductor wafer'20117,655,118'Electrolytic processing apparatus and method'20107,638,030'Electrolytic processing apparatus and electrolytic processing method'20097,569,135'Electrolytic processing apparatus and substrate processing apparatus and method'20097,427,345'Method and device for regenerating ion exchanger, and electrolytic processing apparatus'20087,255,778'Electrochemical machining method and apparatus'20077,208,076'Substrate processing apparatus and method'20077,108,589'Polishing apparatus and method'20067,101,259'Polishing method and apparatus'20067,101,465'Electrolytic processing device and substrate processing apparatus'20066,935,932'Polishing apparatus and method'20056,932,884'Substrate processing apparatus'20056,875,335'Electrolytic machining method and apparatus'20056,743,349'Electrochemical machining method and apparatus'20046,722,964'Polishing apparatus and method'20046,679,950'Cleaning method and cleaner'20046,667,238'Polishing method and apparatus'20036,602,396'Electrolytic machining method and apparatus'20036,543,080'Apparatus and method for cleaning semiconductor substrate'20036,494,220'Apparatus for cleaning a substrate such as a semiconductor wafer'20026,368,493'Electrolytic machining method and apparatus'20026,308,361'Cleaning apparatus'20016,248,009'Apparatus for cleaning substrate'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2016Patents assigned to EBARA CORP (22)· patent assignee history
2001–2016Based in Tokyo, JP· patent location history
2001–2007Based in Fujisawa, JP· patent location history
2002–2005Patents assigned to MORI YUZO (4)· patent assignee history
2002–2005Based in Kanagawa, JP· patent location history
2003–2006Patents assigned to TOSHIBA KK (5)· patent assignee history
2004Based in Fujiswawa, JP· patent location history
2009Based in Saitama-shi, JP· patent location history
2012–2016Patents assigned to SHIRAKASHI MITSUHIKO (2)· patent assignee history
2012Patents assigned to HIROKAWA KAZUTO (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 22 | 2001–2016 |
| TOSHIBA KK | 5 | 2003–2006 |
| MORI YUZO | 4 | 2002–2005 |
| SHIRAKASHI MITSUHIKOself | 2 | 2012–2016 |
| HIROKAWA KAZUTO | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 10 | 2001–2016 |
| Fujisawa, JP | 7 | 2001–2007 |
| Kanagawa, JP | 6 | 2002–2005 |
| Saitama-shi, JP | 1 | 2009 |
| Fujiswawa, JP | 1 | 2004 |