Inventor
Fujio Kuwako
Inventor
Saitama, JP
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits41%
Y10TTechnical subjects covered by former us classification19%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form15%
H01GCapacitors7%
B23KSoldering or unsoldering4%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients4%
C08LCompositions of macromolecular compounds4%
C09DCoating compositions, e.g. paints, varnishes or lacquers4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
10,863,621Metal foil with releasing resin layer, and printed wiring board202010,524,360Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board201910,244,640Copper clad laminate provided with protective layer and multilayered printed wiring board20199,924,597'Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board'20188,866,018'Passive electrical devices and methods of fabricating passive electrical devices'20146,905,757'DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE'20056,884,944'Multi-layer printed wiring boards having blind vias'20056,693,793'Double-sided copper clad laminate for capacitor layer formation and its manufacturing method'20046,551,433'Method for producing copper-clad laminate'20036,240,636'Method for producing vias in the manufacture of printed circuit boards'20016,107,003'Method for producing multi-layer printed wiring boards having blind vias'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2020Patents assigned to MITSUI MINING & SMELTING CO (10)· patent assignee history
2000–2005Based in Urawa, JP· patent location history
2003–2005Based in Ageo, JP· patent location history
2014Patents assigned to HWANG JIN HYUN (1)· patent assignee history
2014Patents assigned to KAGEYAMA YUJI (1)· patent assignee history
2014Patents assigned to KUWAKO FUJIO (1)· patent assignee history
2014Patents assigned to OAK MITSUI TECHNOLOGIES LLC (1)· patent assignee history
2014Based in Clifton Park, NY, US· patent location history
2018–2020Based in Saitama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUI MINING & SMELTING CO | 10 | 2000–2020 |
| HWANG JIN HYUN | 1 | 2014 |
| KAGEYAMA YUJI | 1 | 2014 |
| KUWAKO FUJIOself | 1 | 2014 |
| OAK MITSUI TECHNOLOGIES LLC | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Saitama, JP | 4 | 2018–2020 |
| Ageo, JP | 3 | 2003–2005 |
| Urawa, JP | 3 | 2000–2005 |
| Clifton Park, New York, US | 1 | 2014 |