Inventor
Lyndon W. Graham
Inventor
Kalispell, MT, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
C25DProcesses for the electrolytic or electrophoretic production of coatings30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
G01NInvestigating or analysing materials by determining their chemical or physical properties14%
C23CCoating metallic material2%
PatentTitleYear
7,462,269'Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device'20087,300,562'Platinum alloy using electrochemical deposition'20077,244,677'Method for filling recessed micro-structures with metallization in the production of a microelectronic device'20077,229,543'Apparatus for controlling and/or measuring additive concentration in an electroplating bath'20077,144,805'Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density'20067,135,404'Method for applying metal features onto barrier layers using electrochemical deposition'20067,001,471'Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device'20066,994,776'Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device'2006RE038931'Methods for controlling and/or measuring additive concentration in an electroplating bath'20066,921,468'Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations'20056,899,805'Automated chemical management system executing improved electrolyte analysis method'20056,814,855'Automated chemical management system having improved analysis unit'20046,806,186'Submicron metallization using electrochemical deposition'20046,753,251'Method for filling recessed micro-structures with metallization in the production of a microelectronic device'20046,663,762'Plating system workpiece support having workpiece engaging electrode'20036,599,412'In-situ cleaning processes for semiconductor electroplating electrodes'20036,551,479'Apparatus for controlling and/or measuring additive concentration in an electroplating bath'20036,508,920'Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device'20036,365,033'Methods for controlling and/or measuring additive concentration in an electroplating bath'20026,358,388'Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover'20026,270,647'Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations'20016,099,712'Semiconductor plating bowl and method using anode shield'20005,985,126'Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2008Patents assigned to SEMITOOL INC (22)· patent assignee history
1999–2008Based in Kalispell, MT, US· patent location history
2002Patents assigned to SEMITOOF INC (1)· patent assignee history
2004–2007Based in Hillsboro, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEMITOOL INC | 22 | 1999–2008 |
| SEMITOOF INC | 1 | 2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kalispell, MT, US | 16 | 1999–2008 |
| Hillsboro, OR, US | 7 | 2004–2007 |