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Inventor

Keun-hyuk Lee

Inventor
Bucheon-si, KR

Overview

17→
Patents
2004–2015
Patent span
Electricity
Primary field (CPC H)

Patents· 17 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1068%
H05KPrinted circuits12%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems8%
Y10TTechnical subjects covered by former us classification8%
H01LSemiconductor devices4%
PatentTitleYear
9,130,065'Power module having stacked flip-chip and method for fabricating the power module'20158,350,369'High power semiconductor package'20138,258,622'Power device package and semiconductor package mold for fabricating the same'20128,125,080'Semiconductor power module packages with simplified structure and methods of fabricating the same'20128,013,431'Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the same'20117,986,531'Power system module and method of fabricating the same'20117,951,645'Power module for low thermal resistance and method of fabricating the same'20117,871,848'Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same'20117,842,545'Semiconductor package having insulated metal substrate and method of fabricating the same'20107,808,103'Leadless package'20107,714,428'High power semiconductor package and method of making the same'20107,706,146'Power system module and method of fabricating the same'20107,701,048'Power module for low thermal resistance and method of fabricating the same'20107,675,148'Power module having stacked flip-chip and method of fabricating the power module'20107,659,559'Semiconductor package having insulated metal substrate and method of fabricating the same'20106,774,465'Semiconductor power package module'20046,710,439'Three-dimensional power semiconductor module and method of manufacturing the same'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2015Patents assigned to FAIRCHILD KR SEMICONDUCTOR LTD (17)· patent assignee history
2004Based in Seongbuk-gu, KR· patent location history
2004Based in Seoul, KR· patent location history
2010–2013Based in Bucheon-si, KR· patent location history
2012–2013Patents assigned to LEE KEUN-HYUK (3)· patent assignee history
2012–2013Patents assigned to LIM SEUNG-WON (2)· patent assignee history
2012–2013Patents assigned to PARK SUNG-MIN (2)· patent assignee history
2012–2015Based in Gyeonggi-do, KR· patent location history
2013Patents assigned to LEE TAEK-KEUN (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FAIRCHILD KR SEMICONDUCTOR LTD172004–2015
LEE KEUN-HYUKself32012–2013
LIM SEUNG-WON22012–2013
PARK SUNG-MIN22012–2013
LEE TAEK-KEUN12013
Locations
LocationPatentsSpan
Bucheon-si, KR132010–2013
Gyeonggi-do, KR22012–2015
Seongbuk-gu, KR12004
Seoul, KR12004