Inventor
Boris Binder
Inventor
Dresden, DE
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Cprimary
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems28%
B81BMicrostructural devices or systems, e.g. micromechanical devices26%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure21%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock4%
H01LSemiconductor devices4%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers4%
H10DInorganic electric semiconductor devices4%
G01DMeasuring not specially adapted for a specific variable2%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h102%
PatentTitleYear
10,060,816Sensor structures, systems and methods with improved integration and optimized footprint20189,752,943'Sensor structures, systems and methods with improved integration and optimized footprint'20179,546,923'Sensor structures, systems and methods with improved integration and optimized footprint'20179,527,725'Semiconductor structure with lamella defined by singulation trench'20169,382,111'Micromechanical system and method for manufacturing a micromechanical system'20169,376,314'Method for manufacturing a micromechanical system'20169,236,241'Wafer, a method for processing a wafer, and a method for processing a carrier'20168,994,127'Method of fabricating isolating semiconductor structures using a layout of trenches and openings'20158,921,954'Method of providing a semiconductor structure with forming a sacrificial structure'20148,921,974'Semiconductor manufacturing and semiconductor device with semiconductor structure'20148,723,276'Semiconductor structure with lamella defined by singulation trench'20148,627,720'Acceleration sensor'20148,518,732'Method of providing a semiconductor structure with forming a sacrificial structure'20138,481,400'Semiconductor manufacturing and semiconductor device with semiconductor structure'20138,266,962'Acceleration sensor'20127,832,279'Semiconductor device including a pressure sensor'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2018Patents assigned to INFINEON TECHNOLOGIES AG (11)· patent assignee history
2010–2018Based in Dresden, DE· patent location history
2012–2015Patents assigned to BINDER BORIS (6)· patent assignee history
2012–2015Patents assigned to KAUTZSCH THORALF (6)· patent assignee history
2012–2014Patents assigned to FOESTE BERND (4)· patent assignee history
2016–2018Patents assigned to INFINEON TECHNOLOGIES DRESDEN GMBH (6)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 11 | 2010–2018 |
| BINDER BORISself | 6 | 2012–2015 |
| INFINEON TECHNOLOGIES DRESDEN GMBH | 6 | 2016–2018 |
| KAUTZSCH THORALF | 6 | 2012–2015 |
| FOESTE BERND | 4 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dresden, DE | 16 | 2010–2018 |