Inventor
BERNARDO GALLEGOS
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices35%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
H05KPrinted circuits12%
PatentTitleYear
12,575,025Stress relief structure for flip-chip packaged devices202612,237,249Substrates with solder barriers on leads202512,154,845Semiconductor package with nickel-silver pre-plated leadframe202411,930,590Stress relief for flip-chip packaged devices202411,848,258Semiconductor package with nickel-silver pre-plated leadframe202311,244,881Package terminal cavities2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TEXAS INSTRUMENTS INC (6)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 6 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2022–2026 |