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Inventor

Keiji Maeda

Inventor
Kyoto, JP

Overview

18→
Patents
1998–2013
Patent span
Performing operations
Primary field (CPC B)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics22%
H04LTransmission of digital information, e.g. telegraphic communication14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
Y10TTechnical subjects covered by former us classification11%
C04BLime, magnesia6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
B08BCleaning in general3%
B29LIndexing scheme associated with subclass b29c, relating to particular articles3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds3%
PatentTitleYear
8,611,372'Data transfer system and method'20137,957,416'Data transfer system and method'20117,901,797'Low-adhesion material, resin molding die, and soil resistant material'20117,784,764'Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material'20107,760,662'Data transfer system and method'20107,732,037'Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material'20107,614,293'Method of evaluating adhesion property, low-adhesion material, and mold for molding resin'20097,486,690'Data transfer system and method of transferring data packets using aggregation/disaggregation'20097,407,146'Composite material and resin mold'20087,399,574'Curable resin for photo-patterning, process for producing the same, curable resin composition, color filter, liquid crystal panel substrate, and liquid crystal panel'20087,287,975'Resin mold material and resin mold'20077,084,186'Crosslinkable resin compositions'20066,904,049'Data transfer system and method for transferring data packets over an ATM link'20056,773,247'Die used for resin-sealing and molding an electronic component'20046,368,707'Heat-sensitive adhesive sheet'20026,346,433'Method of coating semiconductor wafer with resin and mold used therefor'20025,783,220'Resin sealing and molding apparatus for sealing electronic parts'19985,750,154'Resin sealing/molding apparatus for electronic parts'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2011Patents assigned to TOWA CORP (9)· patent assignee history
1998–2011Based in Kyoto, JP· patent location history
2002–2006Patents assigned to TOAGOSEI CO LTD (2)· patent assignee history
2002–2006Based in Aichi, JP· patent location history
2005–2013Patents assigned to JUNIPER NETWORKS INC (5)· patent assignee history
2005–2013Based in Tokyo, JP· patent location history
2007–2011Patents assigned to JAPAN FINE CERAMICS CT (5)· patent assignee history
2008Patents assigned to DAINIPPON PRINTING CO LTD (1)· patent assignee history
2008Based in Nagoya, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOWA CORP91998–2011
JAPAN FINE CERAMICS CT52007–2011
JUNIPER NETWORKS INC52005–2013
TOAGOSEI CO LTD22002–2006
DAINIPPON PRINTING CO LTD12008
Locations
LocationPatentsSpan
Kyoto, JP101998–2011
Tokyo, JP52005–2013
Aichi, JP22002–2006
Nagoya, JP12008