Inventor
CHOONG KOOI CHEE
Inventor
MY
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10DInorganic electric semiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H05KPrinted circuits4%
PatentTitleYear
12,237,245Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same202512,125,768Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same202412,112,997Micro through-silicon via for transistor density scaling202412,080,628Micro through-silicon via for transistor density scaling202411,805,602Chip assemblies202311,652,026Micro through-silicon via for transistor density scaling202311,562,959Embedded dual-sided interconnect bridges for integrated-circuit packages202311,527,481Stacked semiconductor package with flyover bridge202211,398,415Stacked through-silicon vias for multi-device packages202211,393,741Micro through-silicon via for transistor density scaling2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INTEL CORP (9)· patent assignee history
2022–2025Based in MY· patent location history
2024–2025Patents assigned to ALTERA CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 9 | 2022–2025 |
| ALTERA CORP | 2 | 2024–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| MY | 10 | 2022–2025 |