Inventor
Chi-Long Tsai
Inventor
Kaohsiung, TW
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1085%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
PatentTitleYear
7,501,311'Fabrication method of a wafer structure'20097,473,998'Method for forming bump protective collars on a bumped wafer'20097,432,188'Structure of bumps forming on an under metallurgy layer and method for making the same'20087,402,510'Etchant and method for forming bumps'20087,261,828'Bumping process'20077,253,519'Chip packaging structure having redistribution layer with recess'20077,129,111'Method for forming bump protective collars on a bumped wafer'20067,105,433'Method for treating wafer surface'20067,041,590'Formation method for conductive bump'20067,015,130'Method for making UBM pads and bumps on wafer'20066,921,716'Wafer bumping process'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2009Patents assigned to ADVANCED SEMICONDUCTOR ENG (11)· patent assignee history
2005–2007Based in Taitung County, TW· patent location history
2006–2009Based in Kaohsiung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 11 | 2005–2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 6 | 2006–2009 |
| Taitung County, TW | 5 | 2005–2007 |