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Inventor

Alexander Weil

Inventor
Mainz, DE

Overview

2→
Patents
2006–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B22Fprimary
B22FWorking metallic powder17%
B23KSoldering or unsoldering17%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering17%
G06FElectric digital data processing17%
H10DInorganic electric semiconductor devices17%
Y02PClimate change mitigation technologies in the production or processing of goods17%
PatentTitleYear
10,882,139Method for the additive manufacture of metallic components20217,105,385'FPGA blocks with adjustable porosity pass thru'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006Patents assigned to IBM (1)· patent assignee history
2006Based in Woodbridge, VA, US· patent location history
2021Patents assigned to Evobeam GmbH (1)· patent assignee history
2021Patents assigned to WAHL MATTHIAS (1)· patent assignee history
2021Patents assigned to WEIL ALEXANDER (1)· patent assignee history
2021Based in Mainz, DE· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
Evobeam GmbH12021
IBM12006
WAHL MATTHIAS12021
WEIL ALEXANDERself12021
Locations
LocationPatentsSpan
Mainz, DE12021
Woodbridge, Virginia, US12006