Inventor
Kyoung-Bok Cho
Inventor
Cheonan-si, KR
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
Y10TTechnical subjects covered by former us classification18%
B23KSoldering or unsoldering9%
H01LSemiconductor devices9%
PatentTitleYear
10,692,833Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same202010,016,833Solder ball mounter20187,074,646'In-line die attaching and curing apparatus for a multi-chip package'20066,863,109'In-line die attaching and curing apparatus for a multi-chip package'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (4)· patent assignee history
2005–2006Based in Chungcheongnam-do, KR· patent location history
2018–2020Based in Cheonan-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 4 | 2005–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cheonan-si, KR | 2 | 2018–2020 |
| Chungcheongnam-do, KR | 2 | 2005–2006 |