Inventor
LEO JOSEPH GRAHAM
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application14%
H01RElectrically-conductive connections14%
G02BOptical elements, systems or apparatus7%
H01LSemiconductor devices7%
Y02PClimate change mitigation technologies in the production or processing of goods7%
PatentTitleYear
12,322,898Heat sink assembly for an electrical connector assembly202511,785,731Cable assembly for a cable connector module202311,486,661Thermal bridge for an electrical component202211,291,140Heat sink assembly for an electrical component202211,240,934Thermal bridge for an electrical component2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TE CONNECTIVITY SOLUTIONS GMBH (3)· patent assignee history
2022Patents assigned to TE Connectivity Services Gmbh (3)· patent assignee history
2022Patents assigned to TEC CONNECTIVITY SERVICES GmbH (1)· patent assignee history
2022–2025Based in US· patent location history
2025Patents assigned to TE CONNECTIVITY CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TE CONNECTIVITY SOLUTIONS GMBH | 3 | 2022–2025 |
| TE Connectivity Services Gmbh | 3 | 2022 |
| TE CONNECTIVITY CORP | 1 | 2025 |
| TEC CONNECTIVITY SERVICES GmbH | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2022–2025 |